Aluminum nitride possesses high thermal conductivity (170 W/mk, 200 W/mk, and 230 W/mk) as well as high volume resistivity and dielectric strength.

Thermal shock is frequently the primary cause of failure in high-temperature applications. It is made up of three components: thermal expansion, thermal conductivity, and strength. Rapid temperature changes, both up and down, cause temperature differentials within the part, similar to a crack caused by rubbing an ice cube against a hot glass. Because of varying expansion and contraction, movement

The automotive industry is keeping up with innovation by utilizing advanced technical ceramics to generate performance-improving changes in both its production processes and the specific components of new-generation vehicles.

Bearings and valves are two of the most common applications for silicon nitride ceramic balls. The production of silicon nitride balls utilizes a process that combines isostatic pressing with gas pressure sintering. The raw materials for this process are silicon nitride fine powder as well as sintering aids such as aluminum oxide and yttrium oxide.

There is a wide variety of advanced ceramics available today, including alumina, zirconia, beryllia, silicon nitride, boron nitride, aluminum nitride, silicon carbide, boron carbide, and many more. Each of these advanced ceramics has its own unique set of performance characteristics and advantages. In order to meet the challenges presented by ever-evolving applications, new materials are consisten

Zirconia is very strong because of its unique tetragonal crystal structure, which is usually mixed with Yttria. Zirconia's small grains make it possible for fabricators to make small details and sharp edges that can stand up to rough use.

Few people are aware of how many industries use technical ceramics on a daily basis. Technical ceramics are a versatile substance that can be utilized in numerous industries for a variety of fascinating purposes. Technical ceramics were designed for a variety of applications.

For electronic packaging, ceramic substrates play a key role in connecting the internal and external heat dissipation channels, as well as both electrical interconnection and mechanical support. Ceramic substrates have the advantages of high thermal conductivity, good heat resistance, high mechanical strength, and low coefficient of thermal expansion, and they are the common substrate materials fo

The basic principle of armor protection is to consume projectile energy, slow it down and render it harmless. While most conventional engineering materials, such as metals, absorb energy through structural deformation, while ceramic materials absorb energy through a micro-fragmentation process.

Hexagonal Boron Nitride ceramic is a material with excellent resistance to high temperature and corrosion, high thermal conductivity, and high insulation properties, it has great promise for development.