Loaʻa iā WINTRUSTEK kahi hui ʻoihana a makemake nui i kā mākou mea kūʻai aku, kōkua iā ʻoe e noʻonoʻo i ka hopena kūpono loa.
Xiamen Wintrustek Advanced Materials Co., Ltd.
ʻO WINTRUSTEK kahi mea hana nui i ʻike ʻia i nā ceramics ʻenehana mai 2014. I loko o nā makahiki i hoʻopaʻa ʻia mākou i ka noiʻi, hoʻolālā, hana a me ke kūʻai aku ʻana ma o ka hāʻawi ʻana i kahi ākea ākea o nā hopena ceramic kiʻekiʻe no nā ʻoihana e noi ana i ka hana waiwai koʻikoʻi e lanakila ai i nā kūlana hana koʻikoʻi.
ʻO kā mākou mau mea seramika he:- Aluminum Oxide - Zirconium Oxide - Beryllium Oxide- Aluminum Nitride- Boron Nitride- Silicon Nitride- Silicon Carbide- Boron Carbide- Macor. Ua koho kā mākou mea kūʻai aku e hui pū me mākou ma muli o kā mākou ʻenehana alakaʻi, ʻoihana, a me ka hoʻokō nā ʻoihana a mākou e lawelawe nei.ʻO ka hana lōʻihi o Wintrustek ka hoʻomaikaʻi ʻana i ka hana o nā mea kiʻekiʻe me ka mālama ʻana i kā mākou manaʻo i ka hauʻoli o ka mea kūʻai aku ma o ka hāʻawi ʻana i nā huahana kiʻekiʻe loa a me ka lawelawe papa mua.
In metal forming work, silicon nitride ceramic extrusion is used to extrude and draw copper, brass, and nimonic alloys. Because of its exceptional resistance to wear, corrosion, and thermal shock, the die lasts longer and requires less maintenance.
Direct Bonded Copper (DBC) ceramic substrates are a new type of composite material in which copper metal is coated on a highly insulating alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate.
An established method for bonding ceramics, brazing is a liquid phase procedure that works especially well for creating joints and seals. Components used in the electronics and automotive industries, for example, can easily be mass-produced using the brazing technique.
Alumina is a good material for ball valves, piston pumps, and deep drawing tools because of its high hardness and good resistance to wear. Additionally, brazing and metalizing processes make it simple to combine with metals and other ceramic materials.
Ma muli o kāna mau waiwai kūʻokoʻa,ʻo Sic he mea makemake nui no nā haʻawina kiʻekiʻe no nā kau kiʻekiʻe e like me nā mahana kiʻekiʻe, kiʻekiʻe ka male.Ua puka maiʻo SIC ma kahi ikaika nui i kaʻoihana semiconductor, e hāʻawi ana i ka mana i nā modulesHoʻohui hou, hiki i SIC ke mālama i nā mea hana kiʻekiʻe