In metal forming work, silicon nitride ceramic extrusion is used to extrude and draw copper, brass, and nimonic alloys. Because of its exceptional resistance to wear, corrosion, and thermal shock, the die lasts longer and requires less maintenance.

Direct Bonded Copper (DBC) ceramic substrates are a new type of composite material in which copper metal is coated on a highly insulating alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate.

An established method for bonding ceramics, brazing is a liquid phase procedure that works especially well for creating joints and seals. Components used in the electronics and automotive industries, for example, can easily be mass-produced using the brazing technique.

Alumina is a good material for ball valves, piston pumps, and deep drawing tools because of its high hardness and good resistance to wear. Additionally, brazing and metalizing processes make it simple to combine with metals and other ceramic materials.

Ma muli o kāna mau waiwai kūʻokoʻa,ʻo Sic he mea makemake nui no nā haʻawina kiʻekiʻe no nā kau kiʻekiʻe e like me nā mahana kiʻekiʻe, kiʻekiʻe ka male.Ua puka maiʻo SIC ma kahi ikaika nui i kaʻoihana semiconductor, e hāʻawi ana i ka mana i nā modulesHoʻohui hou, hiki i SIC ke mālama i nā mea hana kiʻekiʻe

Hiki ke hanaʻo Boron Carbide me nā mea hiki ke hana i nā mea hiki, ke hana i nā kiʻi samucondani kiʻekiʻe, a me nā kiʻi kiʻi i keʻano o ka semicorond.

ʻO Aluminum nitride he mea hoʻohālikelike i ka cerramic me ka hana ikaika a me keʻano ikaika a me keʻano uila. Hanaʻia konaʻano hana nani i kahi mea kaulana loa no nā semiconbortors. Eia kekahi, he koho maikaʻi ia no nāʻano semiconductors ma muli o kona haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa Ma muli o kāna mau pale nui e wela a me nā mea kanu,ʻo Alumini nitride he mea waiwai o Choi

ʻO kahi 19.8% Alumina Cerameral Furamb Arg ka mea i hoʻohanaʻia ma nā kaʻina hana semiconductor e hana ai. ʻO Alumina Ceramic kahiʻano o nā mea cemic me nā mea e hoʻopili ai a me nā mea e pili ana i nā mea hana semiconnductor.

ʻO kekahi mau noi no nā huahana nitride nitride i loko o kaʻoihana aila

ʻO ka paʻa wela ikaika o ka Si3N4 grinding ball i kūpono no ka hoʻohana ʻana i nā kaʻina wili kiʻekiʻe a me ka cryogenic. ʻO ke kūpaʻa wela ʻokoʻa o ka pōleʻa e hiki iā ia ke hoʻomanawanui i nā loli wela nui me ka nalowale ʻole o kāna hana a i ʻole ke ʻano. ʻOi aku ka māmā o 60% ma mua o ke kila, hoʻonui iki i ka thermally, a he haʻahaʻa haʻahaʻa haʻahaʻa o ka hoʻolimalima hana ke hoʻohālikelike ʻia me nā mea wili ʻē aʻe.