(Dbc cemic substrateHanaʻia eWikilfustek)
Hoʻonohonohoʻia i ke keleawe i hoʻopaʻaʻiaheʻano hou o nā mea hoʻohui hou i loko o keʻano keleawe keleawe i hoʻopaʻaʻia ma luna o kahi ahuna nui (Al2O3 ʻO kaʻenehanaʻo Melus Melunna National of Alumina a me Alminim Nitride Crimac subramit. ʻO ka laweʻana i ka moder al2O3 e like me kahi hoʻohālike,ʻo ka cuper foil i kū pololei i ka moderomer ma kahi o ka maʻi maʻi n2.
ʻO ka Hoʻoliloʻana i ke kaiāulu ma nā kiʻekiʻe kiʻekiʻe (1065-1085) e hoʻohālikelike ai i ke keleawe keleawe, a me nā mea hana cuberacter cemit a me keʻano o ka cubsic o ka cheper A laila e hoʻomākaukau i ka laina o ka laina e etching i keʻano e like me keʻano o ka hoʻolālāʻana i ka papa hana kiʻi kiʻi kiʻi. Hoʻohana nuiʻia i loko o ka pāʻana o ka mana o ka mana semicoponductor
ʻO nā papa o nā kamepiula a me nā mea haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa e hoʻohana maʻamau i ka metal a me nā mea hoʻonohonoho Eia naʻe, e hana i nā mea kaomi me ka maikaʻiʻoi aku, e like me Silnicon Nitride, Anumanil nitride, a me Anula
'ŌleloDbc substrateMa ka mana o ka mana uila uila e like me nāʻano'āpana o nā chips (iggt chips, nā chipsDbc substratema o ka papa keleawe keleawe, e hoʻopau i ka'āpana chip o ka pou pili a iʻole e pili ana i ka pā o ka pili. He hana maikaʻi loa ka DBC i nā waiwai maikaʻi, maikaʻi maikaʻi maikaʻi loa i ka hana, ho'ūnā haʻahaʻa a me kahi hoʻonuiʻiaʻana.
'ŌleloDbc substrateLoaʻa i nā hiʻohiʻona likeʻole: maikaʻi loa ka hanaʻana, maikaʻi loa ka hanaʻana, maikaʻi loa i ka hanaʻana, nā hana lapaʻau maikaʻi a me ka hana iʻoi aku ka maikaʻi.
1. Me ka hoʻohanaʻana i kaDbc substrateE like me ke kākoʻoʻana o ke kākoʻo chip i hoʻokaʻawale i ka moditation wela o ka module
2.ʻOi aku ka maikaʻi o keʻano, kaDbc substrateLoaʻa i kahi hana hoʻonaninani maikaʻiʻole me 20-260W / MK, IGBT MODAL i ka papa hana o ka papa hana.
3.ʻO ka laweʻana i ka hana uila. Mai ka mea kūʻai akuʻo Copper i kahi metala e laweʻia ana, hiki ke laweʻia nā mea uila uila e pili ana i ke kū'ē liʻiliʻi i ka hoʻopili pololei ma waena o ke keleawe a me ka subter. Ma muli o kēia, ua kūponoʻo DBC no ka hoʻohanaʻana i nā lako uila uila kiʻekiʻe e pono ai e hoʻouna koke i kaʻikepili a me nā mea uila.
4.ʻO ka hoʻonuiʻia o kaDbc substrateua like ia me ia o ka chip.the dbc substrate a me ka nui o ka expansion e like me ka poki. Ma waho aʻe, loaʻa iā ia nā mea maikaʻi maikaʻi a me ka paleʻana o ka corrosionion. ʻAʻole maʻalahi ka DBC i kaʻaeʻana, a hiki ke hoʻohanaʻia ma luna o kahi ākea ākea.
5. He maikaʻi maikaʻi ka hanaʻana. ʻO ka hana kūpaʻa o kaDbc substratemaikaʻi. ʻOi aku ka nui o ka ROID VIDID ma mua o 5%, aʻo ka dbc substrate he'āpana keleawe he nui e hiki ai ke kauʻia i kahi ukana kiʻekiʻe. Ma ka'āpana likeʻole,ʻo ia ka mea maʻamau e pono ai he 12% o ka laulā o ka PCB, a laila hiki ke hoʻololi i ka mana o ka hui a me nā pono hana. Ma muli o kā lākou hana maikaʻi loa, ua hoʻohana nuiʻia nā mea hana DBC i ka hoʻomākaukauʻana i nāʻano likeʻole o nā semiconnductors kiʻekiʻe.
6. nā lōʻihi loa a lōʻihi loa. I ka pūʻali koa a me nā noi aerospace kahi e hiki ai i nā mea uila ke ola i nā kūlana koʻikoʻi, e hana ana i kahi mea kūʻai ikaika ma waena o ke kumukūʻai ikaika
