ʻO nā seramika i hoʻoheheʻe ʻia he mau seramika i uhi ʻia me kahi ʻāpana metala, e ʻae iā lākou e hoʻopaʻa paʻa i nā mea metala. ʻO kēia kaʻina hana maʻamau e pili ana i ka waiho ʻana i kahi papa metala ma luna o ka ʻili seramika, a ukali ʻia e ka sintering wela kiʻekiʻe e hoʻopaʻa i ka ceramic a me ka metala. ʻO nā mea metala maʻamau ka molybdenum-manganese a me ka nickel. Ma muli o ka insulation maikaʻi loa o ka ceramics, ka wela kiʻekiʻe, a me ka pale ʻana i ka corrosion, hoʻohana nui ʻia nā ceramics metallized i nā ʻoihana uila a me nā ʻoihana uila, ʻoi aku hoʻi i nā mea uila uila, nā uila uila, nā ʻike, a me nā capacitors.
Hoʻohana nui ʻia nā ceramics metallized i nā noi e koi ana i ke kūpaʻa wela kiʻekiʻe, ka ikaika mechanical, a me ka hana uila maikaʻi. No ka laʻana, hoʻohana ʻia lākou i loko o ka ʻeke alakaʻi no nā mea uila uila, substrates no nā mana semiconductor mana, nā wela wela no nā mea laser, a me nā hale no nā lako kamaʻilio kiʻekiʻe. ʻO ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana o nā ceramics metallized e hōʻoia i ka hilinaʻi o kēia mau mea hana i nā kaiapuni koʻikoʻi.
Nā Mea Loaʻa | 95% 96% 99% Alumina, AlN, BeO, Si3N4 |
Nā Huahana Loaʻa | Nā ʻāpana seramika i kūkulu ʻia a me nā ʻāpana seramika |
Loaʻa Metallization | Mo/Mn Metallization ʻO ke ʻano Copper Bonded Direct (DBC) Ke keleawe paʻi pololei (DPC) Hoʻopaʻa metala ʻeleu (AMB) |
Loaʻa Plating | Ni, Cu, Ag, Au |
Nā kikoʻī kikoʻī ma kāu mau noi. |