High-temperature refractory ceramic material 3YSZ, or what we can call tetragonal zirconia polycrystal (TZP), is made of zirconium oxide that has been stabilized with 3% mol yttrium oxide.

A non-metallic compound composed of silicon and nitrogen, silicon nitride (Si3N4) is also an advanced ceramic material with the most adaptable mix of mechanical, thermal, and electrical properties. Additionally, compared to most other ceramics, it is a high-performance ceramic with a low thermal expansion coefficient that offers excellent thermal shock resistance.

Pyrolytic BN or PBN is short for pyrolytic boron nitride. It is a type of hexagonal boron nitride created by the chemical vapor deposition (CVD) method, is also an extremely pure boron nitride that can reach more than 99.99%, covering almost no porosity.

​Silicon carbide (SiC) is a ceramic material that is frequently grown as a single crystal for semiconductor applications. Due to its inherent material properties and single-crystal growth, it is one of the most durable semiconductor materials on the market. This durability extends far beyond its electrical functionality.

Boron Nitride (BN) ceramics are among the most effective technical-grade ceramics. They combine exceptional temperature-resistant properties, such as high thermal conductivities, with high dielectric strength and exceptional chemical inertness to solve problems in some of the world's most demanding application areas.

Substrates made of thin-film ceramic are also referred to as semiconductor materials. It is made up of a number of thin layers that have been built up utilizing vacuum coating, deposition, or sputtering methods. Glass sheets with a thickness of less than one millimeter that is two-dimensional (flat) or three-dimensional are considered thin-film ceramic substrates. They can be manufactured from a v

While Si3N4 combines excellent thermal conductivity and mechanical performance. The thermal conductivity can be specified at 90 W/mK, and its fracture toughness is the highest among the compared ceramics. These characteristics suggest that Si3N4 will exhibit the highest reliability as a metalized substrate.

Boron nitride ceramics have remarkable strength and thermal performance that is remarkably stable, making them an ideal choice for making the nozzles that are used in the atomization of molten metal.

Boron Carbide (B4C) is a durable ceramic composed of Boron and carbon. Boron Carbide is one of the hardest substances known, ranking third behind cubic Boron nitride and diamond. It is a covalent material utilized in a variety of crucial applications, including tank armor, bulletproof vests, and engine sabotage powders. In fact, it is the preferred material for a variety of industrial applications

High thermal conductivity and low coefficient of thermal expansion. This combination of properties provides exceptional thermal shock resistance, making Silicon Carbide ceramics useful in a wide range of industries. It is also a semiconductor and its electrical properties make it suitable for a wide range of applications. It is also known for its extreme hardness and corrosion resistance.