Hexagonal Boron Nitride ceramic is a material with excellent resistance to high temperature and corrosion, high thermal conductivity, and high insulation properties, it has great promise for development.

Due to the ideal thermal conductivity of beryllium oxide ceramic, it is conducive to improving the service life and quality of devices, facilitating the development of devices to miniaturization and increase the power of devices, therefore, it can be widely used in aerospace, nuclear power, metallurgical engineering, electronic industry, rocket manufacturing, etc.

Aluminum Nitride ceramics have excellent overall performance, are ideal for semiconductor substrates and structural packaging materials, and have significant application potential in the electronics industry.

Silicon nitride is the best ceramic substrate material with high thermal conductivity and reliability at home and abroad. Although the thermal conductivity of the Si3N4 ceramic substrate is slightly lower than that of AlN, its flexural strength and fracture toughness can reach more than twice that of AlN.

Since the 21st century, bulletproof ceramics have developed rapidly with more and more materials, including Alumina ceramic, Silicon Carbide ceramic, Boron Carbide ceramic, Silicon Nitride Ceramic, Titanium Diboride ceramic, etc. Among them, Alumina (Al2O3) ceramics, Silicon Carbide (SiC) ceramics and Boron Carbide (B4C) ceramics are the most widely used.