In metal forming work, silicon nitride ceramic extrusion is used to extrude and draw copper, brass, and nimonic alloys. Because of its exceptional resistance to wear, corrosion, and thermal shock, the die lasts longer and requires less maintenance.

Direct Bonded Copper (DBC) ceramic substrates are a new type of composite material in which copper metal is coated on a highly insulating alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate.

An established method for bonding ceramics, brazing is a liquid phase procedure that works especially well for creating joints and seals. Components used in the electronics and automotive industries, for example, can easily be mass-produced using the brazing technique.

Alumina is a good material for ball valves, piston pumps, and deep drawing tools because of its high hardness and good resistance to wear. Additionally, brazing and metalizing processes make it simple to combine with metals and other ceramic materials.

由於其獨特的特性，SIC是需要高溫，高電流和高導熱率的高功率應用的非常理想的材料。SIC已成為半導體業務的主要力量，為電力模塊，Schottky Diodes和MOSFET提供電力，用於高效，高功率應用。此外，SIC可以處理高運行頻率

具有半導體功能和強導熱率的硼碳化物陶瓷可以用作高溫半導體組件以及氣體分佈磁盤，聚焦環，微波爐或紅外窗口以及半導體部門的DC插頭。

氮化鋁是一種具有較強熱和電導率的絕緣陶瓷。其強大的導熱率使其成為半導體的流行材料。此外，由於其低膨脹係數且耐氧化性強，因此對於各種半導體而言，這是一個不錯的選擇。由於對熱和化學物質的耐藥性極大，氮化鋁是Choi的材料

99.8％的氧化鋁陶瓷裝載機臂是半導體製造過程中使用的組件。氧化鋁陶瓷是一種具有出色電絕緣和高導熱性特性的陶瓷材料，使其適用於各種半導體應用。陶瓷臂通常用於半導體生產設備中，例如晶圓機器人和拾取機器人和PLP

油田行業中氮化矽產品的一些應用

Si3N4磨球的強熱穩定性使其適合用於高溫和低溫研磨製程。該球卓越的耐熱性使其能夠承受劇烈的溫度變化而不會失去其功能或形狀。與其他研磨介質相比，它比鋼輕 60%，熱膨脹更小，整體運作費用更低