Ma muli o ka conductivity thermal maikaʻi o ka beryllium oxide ceramic, he mea kūpono ia i ka hoʻomaikaʻi ʻana i ke ola lawelawe a me ka maikaʻi o nā mea hana, hoʻomaʻamaʻa i ka hoʻomohala ʻana o nā mea hana i ka miniaturization a hoʻonui i ka mana o nā mea hana, no laila, hiki ke hoʻohana nui ʻia i ka aerospace, ka mana nuklea. , ʻenehana metallurgical, ʻoihana uila, hana rocket, etc.

He maikaʻi ka hana holoʻokoʻa holoʻokoʻa o nā seramika Aluminum Nitride, kūpono no nā substrates semiconductor a me nā mea hoʻopihapiha hoʻopihapiha, a loaʻa iā ia ka mana hoʻohana nui i ka ʻoihana uila.

ʻIke ʻia ʻo Si3N4 ʻo ia ka mea ʻoi loa o ka ceramic substrate material me ka thermal conductivity kiʻekiʻe a me ka hilinaʻi kiʻekiʻe ma ka home a ma waho. ʻOiai ʻoi aku ka haʻahaʻa o ka hoʻoili wela o ka substrate ceramic Si3N4 ma mua o ko AlN, hiki i kona ikaika flexural a me kona paʻakikī haʻihaʻi ke piʻi aku ma mua o ʻelua o AlN. I kēia manawa, ʻoi aku ka kiʻekiʻe o ka conductivity thermal o Si3N4 ceramic ma mua o ka Al2O3 c

Mai ka 21st century, ua ulu wikiwiki nā seramika pōkā me nā ʻano ʻē aʻe, e like me Alumina, Silicon Carbide, Boron carbide, silicon Nitride, Titanium Boride, etc. (B4C) ka mea i hoʻohana nui ʻia.