No ka hoʻopili uila, hana nui nā substrates seramika i ka hoʻopili ʻana i nā kahawai hoʻoheheʻe wela o loko a me waho, a me ka pilina uila a me ke kākoʻo mechanical. Loaʻa i nā substrate seramika nā mea maikaʻi o ka conductivity thermal kiʻekiʻe, ke kūpaʻa wela maikaʻi, ka ikaika mechanical kiʻekiʻe, a me ka coefficient haʻahaʻa o ka hoʻonui ʻana i ka wela, a ʻo lākou nā mea substrate maʻamau no ka hoʻopili uila mana semiconductor.
Ma ke ʻano o ka hoʻolālā a me ke kaʻina hana, ua hoʻokaʻawale ʻia nā substrate seramika i 5 mau ʻano.
Nā Pānaʻi Paʻa Pahu Puhi Hoʻohuihui ʻia i ka Mahana Kiʻekiʻe (HTCC)
ʻO nā kumulāʻau seramika i hoʻohana pū ʻia me ka wela haʻahaʻa (LTCC)
Nā Substrates Keramic Film Mānoanoa (TFC)
Nā Paʻa Kopa Seramika i hoʻopaʻa pololei ʻia (DBC)
Nā Papahana Copper Ceramic (DPC)
Nā Kaʻina Hana Hana ʻokoʻa
Hoʻokumu ʻia ka substrate seramika Direct Bonded Copper (DBC) ma o ka hoʻohui ʻana i ka oxygen ma waena o ke keleawe a me ka ceramic e loaʻa ai ka hopena eutectic Cu-O ma waena o 1065 ~ 1083 ℃, a ukali ʻia e ka hopena e loaʻa ai ka manawa waena (CuAlO2 a i ʻole CuAl2O4), pēlā e ʻike ai i ka hui ʻana o ka metallurgical. ʻO ka pā Cu a me ka substrate seramika, a laila ʻike hope i ka hoʻomākaukau kiʻi e ka ʻenehana lithography e hana i ke kaapuni.
ʻO ke koena hoʻonui wela o ka substrate DBC kahi kokoke loa i nā mea epitaxial LED, hiki ke hoʻemi nui i ke kaumaha wela i hana ʻia ma waena o ka chip a me ka substrate.
Hana ʻia ka pāpaʻi seramika Direct Plated Copper (DPC) ma ka sputtering ʻana i kahi ʻāpana keleawe ma ka substrate seramika, a laila e hōʻike, etched, de-filmed, a hoʻonui hope i ka mānoanoa o ka laina keleawe ma o ka electroplating a i ʻole ka hoʻoheheʻe kemika, ma hope o ka wehe ʻana i ka photoresist, ka ua pau ka laina metala.
Nā Pono a me nā pōʻino likeʻole
Nā pono o ka DBC Ceramic Substrate
Ma muli o ka maikaʻi o ka uila a me ka thermal conductivity, ua loaʻa iā DBC nā mea maikaʻi o ka conductivity thermal maikaʻi, insulation maikaʻi, hilinaʻi kiʻekiʻe, a ua hoʻohana nui ʻia i nā pūʻulu IGBT, LD, a me CPV. Ma muli o ka ʻeleʻele keleawe mānoanoa (100 ~ 600μm), loaʻa iā ia nā pōmaikaʻi ma ke kahua o IGBT a me LD packaging.
Nā hemahema o ka DBC Ceramic Substrate
Hoʻohana ke kaʻina hana i kahi hopena eutectic ma waena o Cu a me Al2O3 i nā mahana kiʻekiʻe, kahi e koi ai i kahi kiʻekiʻe o nā lako hana a me ka mana kaʻina hana, no laila e kiʻekiʻe ke kumukūʻai.
Ma muli o ka maʻalahi o ka microporosity ma waena o ka papa Al2O3 a me Cu, kahi e hōʻemi ai i ka pale ʻana o ka haʻalulu wela o ka huahana, lilo kēia mau hemahema i ka bottleneck o ka hoʻolaha substrate DBC.
Pono o DPC Ceramic Substrate
Hoʻohana ʻia ke kaʻina hana haʻahaʻa haʻahaʻa (ma lalo o 300 ° C), e pale loa i nā hopena maikaʻi ʻole o ke kiʻekiʻe kiʻekiʻe ma luna o ka mea a i ʻole ka laina laina, a hoʻemi pū i ke kumukūʻai o ke kaʻina hana.
ʻO ka hoʻohana ʻana i ka ʻenehana kiʻi ʻoniʻoni a me ka photolithography, i ʻoi aku ka maikaʻi o ka substrate ma ka laina metala, no laila ʻoi aku ka maikaʻi o ka substrate DPC no ka alignment o nā koi kikoʻī kiʻekiʻe no ka hoʻopili ʻana o nā mea uila.
Nā hemahema o ka DPC Ceramic Substrate
ʻO ka mānoanoa liʻiliʻi o ka papa keleawe i waiho ʻia i electroplated a me ka haumia kiʻekiʻe o ka hoʻonā ʻōpala electroplating.
He haʻahaʻa ka ikaika paʻa ma waena o ka papa metala a me ka ceramic, a haʻahaʻa ka hilinaʻi o ka huahana ke hoʻohana ʻia.
