Ngenxa ye-thermal conductivity ye-beryllium oxide ceramic, inceda ekuphuculeni ubomi benkonzo kunye nomgangatho wezixhobo, iququzelele ukuphuhliswa kwezixhobo kwi-miniaturization kunye nokwandisa amandla ezixhobo, ngoko ke, inokusetyenziswa ngokubanzi kwi-aerospace, amandla enyukliya. , ubunjineli besinyithi, ishishini lombane, ukwenziwa kweerokethi, njl.

I-Aluminium Nitride ceramics inomsebenzi ogqwesileyo jikelele, ilungele i-semiconductor substrates kunye ne-structural package materials, kwaye inamandla okusebenza abalulekileyo kwishishini le-elektroniki.

I-Si3N4 yamkelwa njengeyona nto ibalaseleyo ye-ceramic substrate ene-conductivity ephezulu ye-thermal kunye nokuthembeka okuphezulu ekhaya nakwamanye amazwe. Nangona i-thermal conductivity ye-Si3N4 ye-ceramic substrate ingaphantsi kancinane kune-AlN, amandla ayo okuguquguquka kunye nokuqina kwe-fracture inokufikelela ngaphezu kokuphindwe kabini kwe-AlN. Ngeli xesha, i-thermal conductivity ye-Si3N4 ceramic iphezulu kakhulu kune-Al2O3 c.

Ukususela kwinkulungwane ye-21, iiceramics ze-bulletproof ziye zaphuhliswa ngokukhawuleza kunye neentlobo ezininzi, kuquka i-Alumina, i-Silicon Carbide, i-Boron carbide, i-silicon Nitride, i-Titanium Boride, njl. Phakathi kwabo, i-Alumina Ceramics (Al2O3), i-Silicon Carbide ceramics (SiC) kunye ne-Boron Carbide Ceramics. (B4C) zezona zisetyenziswa kakhulu.