Iibheringi kunye neevalvu zimbini zezona zicelo zixhaphakileyo kwiibhola ze-silicon nitride ceramic. Ukuveliswa kweebhola ze-silicon nitride zisebenzisa inkqubo edibanisa ukucinezela kwe-isostatic kunye ne-gas pressure sintering. Izinto ekrwada zale nkqubo yisilicon nitride umgubo ocolekileyo kwakunye nezixhobo zokucoca ezifana ne-aluminium oxide kunye ne-yttrium oxide.

Kukho iintlobo ngeentlobo zeekeramikhi eziphambili ezikhoyo namhlanje, kubandakanya i-alumina, i-zirconia, i-beryllia, i-silicon nitride, i-boron nitride, i-aluminium nitride, i-silicon carbide, i-boron carbide, kunye nezinye ezininzi. Nganye kwezi zeramics eziphambili zineseti yazo ekhethekileyo yeempawu zokusebenza kunye neenzuzo. Ukuze kuhlangatyezwane nemingeni evezwa zizicelo ezihlala zivela, izixhobo ezintsha ziyahambelana

I-Zirconia yomelele kakhulu ngenxa yesakhiwo sayo esikhethekileyo sekristale ye-tetragonal, edla ngokuxutywa kunye neYttria. Iinkozo ezincinci zeZirconia zenza ukuba abaqulunqi benze iinkcukacha ezincinci kunye nemiphetho ebukhali enokuthi ikwazi ukumelana nokusetyenziswa kakubi.

Bambalwa abantu abaziyo ukuba mangaphi na amashishini asebenzisa ii-ceramics zobugcisa mihla le. Iiseramikhi zobugcisa ziyinto eguquguqukayo enokuthi isetyenziswe kumashishini amaninzi ngeenjongo ezahlukeneyo ezinomdla. Iiseramics zobugcisa zenzelwe usetyenziso oluhlukeneyo.

Ukupakishwa kwe-elektroniki, ii-substrates ze-ceramic zidlala indima ephambili ekudibaniseni imijelo yangaphakathi nangaphandle yokutshatyalaliswa kobushushu, kunye nokudibanisa kombane kunye nenkxaso yomatshini. Iisubstrate zeCeramic zinezibonelelo zokuqhuba kwe-thermal ephezulu, ukumelana nobushushu okulungileyo, amandla omatshini aphezulu, kunye ne-coefficient ephantsi yokwandiswa kwe-thermal, kwaye zizixhobo eziqhelekileyo ze-substrate.

Umgaqo osisiseko wokhuseleko lwesikrweqe kukusebenzisa amandla eprojectile, uwathothe kwaye uwenze angabinabungozi. Ngelixa uninzi lwezixhobo zobunjineli eziqhelekileyo, ezinje ngesinyithi, zifunxa amandla ngoguquko lwesakhiwo, ngelixa izixhobo zekeramic zifunxa amandla ngenkqubo yokuqhekeka kancinci.

I-Hexagonal Boron Nitride ceramic sisixhobo esinamandla okumelana nobushushu obuphezulu kunye ne-corrosion, i-thermal conductivity ephezulu, kunye nepropathi ephezulu yokugquma, inesithembiso esikhulu sophuhliso.

Ngenxa ye-thermal conductivity ye-beryllium oxide ceramic, inceda ekuphuculeni ubomi benkonzo kunye nomgangatho wezixhobo, iququzelele ukuphuhliswa kwezixhobo kwi-miniaturization kunye nokwandisa amandla ezixhobo, ngoko ke, inokusetyenziswa ngokubanzi kwi-aerospace, amandla enyukliya. , ubunjineli besinyithi, ishishini lombane, ukwenziwa kweerokethi, njl.

I-Aluminium Nitride ceramics inomsebenzi ogqwesileyo jikelele, ilungele i-semiconductor substrates kunye ne-structural package materials, kwaye inamandla okusebenza abalulekileyo kwishishini le-elektroniki.

I-Si3N4 yamkelwa njengeyona nto ibalaseleyo ye-ceramic substrate ene-conductivity ephezulu ye-thermal kunye nokuthembeka okuphezulu ekhaya nakwamanye amazwe. Nangona i-thermal conductivity ye-Si3N4 ye-ceramic substrate ingaphantsi kancinane kune-AlN, amandla ayo okuguquguquka kunye nokuqina kwe-fracture inokufikelela ngaphezu kokuphindwe kabini kwe-AlN. Ngeli xesha, i-thermal conductivity ye-Si3N4 ceramic iphezulu kakhulu kune-Al2O3 c.