In metal forming work, silicon nitride ceramic extrusion is used to extrude and draw copper, brass, and nimonic alloys. Because of its exceptional resistance to wear, corrosion, and thermal shock, the die lasts longer and requires less maintenance.

Direct Bonded Copper (DBC) ceramic substrates are a new type of composite material in which copper metal is coated on a highly insulating alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate.

An established method for bonding ceramics, brazing is a liquid phase procedure that works especially well for creating joints and seals. Components used in the electronics and automotive industries, for example, can easily be mass-produced using the brazing technique.

Alumina is a good material for ball valves, piston pumps, and deep drawing tools because of its high hardness and good resistance to wear. Additionally, brazing and metalizing processes make it simple to combine with metals and other ceramic materials.

Ka lebaka la thepa ea eona e ikhethang, sic ke boitsebiso bo lakatsehang haholo bakeng sa likopo tse phahameng tse hlokang lithemparetjha tse phahameng, tse phahameng hona joale le ho eketseha ha mocheso oa hona joale.SIC e hlahile e le matla a maholo khoebong ea semicondtorNtle le moo, sic e khona ho sebetsana le lefu la ho sebetsa khafetsa

Boron carbics ka bokhoni ba semicondtor le boits'oaro bo matla ba semiconductor bo ka sebelisoa e le likarolo tse phahameng tsa semiconductor, hammoho le lifensetere tsa khase, microwave ea khase.

Aluminium nitride ke simatike e thata e nang le moea o matla o futhumetseng le oa motlakase. Phetohelo ea eona e matla e matla e etsa hore e be thepa e tsebahalang bakeng sa seicouctors. Ho feta moo, ke khetho e ntle bakeng sa mefuta e mengata ea semiconductors ka lebaka la ho lemala ka setotsoana le ho hanyetsa ka thata ho oxidation. Ka lebaka la khanyetso ea eona e kholo ho mocheso le lik'hemik'hale, aluminum nitride ke thepa ea choi

Letsoho la 99.8% Alumina le entsoe ka karolo e sebelisoang ka har'a semiconductor lits'ebetsong tsa thepa. Mofuta oa alumina ke mofuta oa thepa ea Ceramic e nang le thepa e ntle ea motlakase, letlapa le phahameng le etsang hore e be le lisebelisoa tsa tlhahiso ea semicondtor tse kang liroboto tse patehileng le ho khetha

Kopo e meng ea kopo ea lihlahisoa tsa nitride nitride nitride ka indasteri ea oli ea oli

Botsitso bo matla ba mocheso oa bolo ea Si3N4 bo etsa hore e be bo loketseng bakeng sa tšebeliso ea mocheso o phahameng le mekhoa ea ho sila ea cryogenic. Ho hanyetsa mocheso o ikhethang oa bolo ho e lumella ho mamella liphetoho tse matla tsa mocheso ntle le ho lahleheloa ke ts'ebetso kapa sebopeho sa eona. E bobebe ka 60% ho feta tšepe, e atoloha ka mocheso o tlase, 'me e na le litšenyehelo tse tlase tsa ts'ebetso ha e bapisoa le mokhoa o mong oa ho sila.