POTSO

Li-ceramics tse entsoeng ka tšepe ke li-ceramics tse koahetsoeng ka lera la tšepe, tse li lumellang hore li tlamahane ka thata ho likarolo tsa tšepe. Ts'ebetso ena hangata e kenyelletsa ho beha lera la tšepe holim'a ceramic holim'a metsi, e lateloe ke sintering e phahameng ea mocheso ho tlama ceramic le tšepe. Lisebelisoa tse tloaelehileng tsa metallization li kenyelletsa molybdenum-manganese le nickel. Ka lebaka la tšireletso e ntle haholo ea li-ceramics, mocheso o phahameng le ho hanyetsa kutu, lirafshoa tse entsoeng ka tšepe li sebelisoa haholo indastering ea lisebelisoa tsa elektroniki le tsa motlakase, haholo lisebelisoa tsa elektroniki tsa vacuum, lisebelisoa tsa elektroniki tsa motlakase, li-sensor le li-capacitor.


Metallized ceramics e sebelisoa haholo lits'ebetsong tse hlokang botsitso ba mocheso o phahameng, matla a mochini le ts'ebetso e ntle ea motlakase. Ka mohlala, li sebelisoa ka har'a liphutheloana tsa loto bakeng sa lisebelisoa tsa elektroniki tsa vacuum, li-substrates bakeng sa lisebelisoa tsa semiconductor ea matla, lisinki tsa mocheso bakeng sa lisebelisoa tsa laser, le matlo a lisebelisoa tsa puisano tsa maqhubu a phahameng. Ho tiisoa le ho tlamahanngoa ha lirafshoa tse entsoeng ka tšepe ho netefatsa ho tšepahala ha lisebelisoa tsena libakeng tse feteletseng.


Lisebelisoa Tse Fumanehang95% 96% 99% Alumina, AlN, BeO, Si3N4
Lihlahisoa tse fumanehangLikarolo tsa Ceramic tsa Sebopeho le Li-Ceramic Substrates
Metallization e fumanehangMo/Mn Metallization
Mokhoa oa Direct Bonded Copper (DBC)
Direct Plating Copper (DPC)
Active Metal Brazing (AMB)
Plating e fumanehangKe, Cu, Ag, Au
Litlhaloso tse ikhethileng mabapi le likopo tsa hau. 


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