Direct bonded copper (DBC) ceramic substrates consist of a ceramic isolator, Al2O3 (aluminum oxide) or AlN (aluminum nitride), onto which pure copper is bonded in a high-temperature melting and diffusion process. 

Wintrustek now offers Direct Bonded Copper (DBC) products on Alumina and Aluminum Nitride that are both cost-effective and quick to produce. Due to the high thermal conductivity, high current capacity, and heat dissipation of the high-purity copper on ceramic, Direct Bonded Copper is a widely accepted and time-tested technology for power electronic components. By varying copper and ceramic thickness and ceramic type, it is possible to modify the resulting CTE value of a system in order to avoid a mismatch between the CTEs of various semiconductor devices. The addition of optional dimple features to your design significantly improves thermal cycling reliability by reducing thermally induced stress and effectively increasing thermal cycling reliability. 

Typical applications are power switches like IGBT and MOSFETs mostly used in power electronics, laser applications, Solar applications, and automotive applications like HYBRID CARS. 

Advantages of Direct Bonded Copper (DBC): 

Very high-temperature resistance and thermal cycling reliability 

Outstandig heat conductivity 

High electrical isolation 

Low CTE (coefficient of thermal expansion) 

Excellente metallization adhesion 

Good mechanical strength and stability High current handling capacity

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Xiamen Wintrustek Advanced Materials Co., Ltd.

ADDRESS：No.987 Huli Hi-Tech Park, Xiamen, China 361009
Phone：0086 13656035645
Tel：0086-592-5716890

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