Bakeng sa liphutheloana tsa elektronike, li-substrates tsa ceramic li phetha karolo ea bohlokoa ho hokahanya likanale tsa ka hare le tsa ka ntle tsa mocheso, hammoho le ho kopanya motlakase le tšehetso ea mechine. Li-ceramic substrates li na le melemo ea ho ba le mocheso o phahameng oa mocheso, ho hanyetsa mocheso o motle, matla a phahameng a mochine, le coefficient e tlase ea katoloso ea mocheso, 'me ke lisebelisoa tse tloaelehileng tsa substrate bakeng sa ho paka sesebelisoa sa semiconductor ea matla.
Mabapi le sebopeho le ts'ebetso ea tlhahiso, li-substrates tsa ceramic li arotsoe ka mefuta e 5.
Lisebelisoa tsa Ceramic tsa Multilayer Ceramic Substrates (HTCC)
Litšepe tsa Ceramic Substrates (LTCC)
Thick Film Ceramic Substrates (TFC)
Li-Ceramic Substrates tsa Direct Bonded Copper (DBC)
Lisebelisoa tsa Direct Plated Copper Ceramic (DPC)
Mekhoa e fapaneng ea Tlhahiso
Direct Bonded Copper (DBC) ceramic substrate e hlahisoa ka ho eketsa oksijene pakeng tsa koporo le ceramic ho fumana tharollo ea Cu-O eutectic pakeng tsa 1065 ~ 1083 ℃, e lateloa ke karabelo ea ho fumana karolo e bohareng (CuAlO2 kapa CuAl2O4), kahoo ho hlokomela motsoako oa lik'hemik'hale oa metallurgical. ea Cu poleiti le ceramic substrate, 'me joale qetellong hlokomela ho lokisetsa litšoantšo ka theknoloji ea lithography ho theha potoloho.
Coefficient ea ho atolosa mocheso oa substrate ea DBC e haufi haholo le ea lisebelisoa tsa LED epitaxial, tse ka fokotsang haholo khatello ea mocheso e hlahisoang pakeng tsa chip le substrate.
Direct Plated Copper (DPC) ceramic substrate e entsoe ka ho fafatsa lesela la koporo holim'a ceramic substrate, ebe e pepesa, e tekiloe, ea tlosoa filimi, 'me qetellong ea eketsa botenya ba mohala oa koporo ka electroplating kapa chemical plating, ka mor'a ho tlosa photoresist, metalized line e phethoa.
Melemo le Mefokolo e Fapaneng
Melemo ea DBC Ceramic Substrate
Kaha foil ea koporo e na le conductivity e ntle ea motlakase le ea mocheso, DBC e na le melemo ea ho tsamaisa mocheso o motle, ho kenya letsoho hantle, ho tšepahala haholo, 'me e sebelisitsoe haholo ka har'a liphutheloana tsa IGBT, LD, le CPV. Haholo-holo ka lebaka la foil e teteaneng ea koporo (100 ~ 600μm), e na le melemo e totobetseng tšimong ea liphutheloana tsa IGBT le LD.
Mathata a DBC Ceramic Substrate
Ts'ebetso ea tlhahiso e sebelisa mokhoa oa eutectic pakeng tsa Cu le Al2O3 ka mocheso o phahameng, o hlokang boemo bo phahameng ba lisebelisoa tsa tlhahiso le taolo ea ts'ebetso, kahoo ho etsa hore litšenyehelo li phahame.
Ka lebaka la tlhahiso e bonolo ea microporosity pakeng tsa Al2O3 le Cu layer, e fokotsang mocheso oa mocheso oa sehlahisoa, mefokolo ena e fetoha botlolo ea ts'ebetso ea DBC substrate.
Melemo ea DPC Ceramic Substrate
Ts'ebetso e tlase ea mocheso (ka tlase ho 300 ° C) e sebelisoa, e qobang ka ho feletseng liphello tse mpe tsa mocheso o phahameng holim'a thepa kapa mohaho oa line, hape o fokotsa litšenyehelo tsa mokhoa oa ho etsa thepa.
Tšebeliso ea theknoloji e tšesaane ea filimi le photolithography, e le hore substrate holim'a mohala oa tšepe o motle, kahoo substrate ea DPC e loketse bakeng sa ho lumellana le litlhoko tse phahameng tsa ho nepahala bakeng sa ho paka lisebelisoa tsa elektronike.
Mathata a DPC Ceramic Substrate
Limited botenya ba electroplated beha koporo lera le tšilafalo e phahameng ea electroplating litšila tharollo.
Matla a ho kopanya pakeng tsa lera la tšepe le ceramic a tlaase, 'me ho tšepahala ha sehlahisoa ho tlaase ha ho sebelisoa.
