Baakadaha elektiroonigga ah, substrate-yada dhoobada ayaa door muhiim ah ka ciyaara isku xirka kanaalada kuleylka gudaha iyo dibadda, iyo sidoo kale isku xirka korantada iyo taageerada farsamada. Substrate-yada dhoobada ah waxay leeyihiin faa'iidooyinka kuleylka kuleylka sarreeya, caabbinta kulaylka wanaagsan, xoogga farsamada sare, iyo isku-dhafka hooseeya ee ballaarinta kulaylka, waana agabka substrate-ka caadiga ah ee baakadaha qalabka semiconductor.
Marka la eego qaab dhismeedka iyo habka wax soo saarka, substrate-ka dhoobada waxaa loo kala saaraa 5 nooc.
Substrates Ceramic Multilayer (HTCC) Heerkulka Sare ee Isku-dhafan
Substrates Ceramic Substrates (LTCC) Isku-shir kuleyl-hooseeya
Substrates Ceramic Film (TFC)
Substrates Ceramic Substrates (DBC) ee tooska ugu xidhan
Walxaha dhoobada ah ee Tooska ah ee Dahaaran (DPC)
Nidaamyada Wax-soo-saarka ee kala duwan
Substrate Dhererka Tooska ah ee Copper (DBC) dhoobada waxaa la soo saaraa iyadoo lagu darayo ogsijiin inta u dhaxaysa naxaasta iyo dhoobada si loo helo xalka Cu-O eutectic inta u dhaxaysa 1065 ~ 1083 ℃, oo ay ku xigto falcelinta si loo helo wejiga dhexe (CuAlO2 ama CuAl2O4), sidaas awgeed garashada isku dhafka macdanta kiimikada of saxan Cu iyo substrate dhoobada, ka dibna ugu dambeyntii ogaan diyaarinta garaafka by technology lithography si ay u sameeyaan wareegga.
Isku-dhafka fidinta kulaylka ee substrate-ka DBC wuxuu aad ugu dhow yahay qalabka LED-ka epitaxial, kaas oo si weyn u yareeyn kara cadaadiska kulaylka ee ka dhex dhasha chip-ka iyo substrate-ka.
Substrate Plated Direct Plated (DPC) , , , , ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, kordhin dhumucda line naxaas ah, xariiq bir ah ayaa la dhamaystiray.
Faa'iidooyinka iyo khasaaraha kala duwan
Faa'iidooyinka Substrate-ka dhoobada ah ee DBC
Maadaama maadada naxaasta ay leedahay koronto iyo kulayl wanaagsan, DBC waxay leedahay faa'iidooyinka kulaylka wanaagsan, dahaarka wanaagsan, isku halaynta sare, waxaana si weyn loogu isticmaalay xirmooyinka IGBT, LD, iyo CPV. Gaar ahaan sababtoo ah foornada naxaasta ah ee dhumucdiisuna waxay tahay (100 ~ 600μm), waxay leedahay faa'iidooyin muuqda oo ku saabsan baakadaha IGBT iyo LD.
Faa'iido darrada DBC Substrate-ka dhoobada
Habka wax soo saarka wuxuu shaqaaleeyaa falcelinta eutectic ee u dhexeeya Cu iyo Al2O3 heerkulka sare, taas oo u baahan heer sare oo qalab wax soo saar ah iyo xakamaynta habka, sidaas awgeed qiimaha sare.
Sababo la xiriira jiilka fudud ee microporosity ee u dhexeeya lakabka Al2O3 iyo Cu, kaas oo yareynaya caabbinta shoogga kulaylka ee badeecada, khasaarooyinkan ayaa noqda cirifka sare ee dhiirrigelinta substrate DBC.
Faa'iidooyinka DPC Substrate dhoobada
Habka heerkulka hooseeya (ka hooseeya 300 ° C) ayaa la isticmaalaa, kaas oo si buuxda uga fogaanaya saameynta xun ee heerkulka sare ee qalabka ama qaabka khadka, sidoo kale wuxuu yareeyaa kharashka habka wax soo saarka.
Isticmaalka filimka khafiifka ah iyo tignoolajiyada sawir-qaadista, sidaa darteed substrate-ka khadka birta ee finer-ka, sidaa darteed substrate-ka DPC wuxuu ku habboon yahay is-waafajinta shuruudaha saxda ah ee sare ee baakadaha aaladaha elektiroonigga ah.
Khasaaraha ka dhashay Substrate Ceramic DPC
Dhumucdiisuna waxay xaddidan tahay lakabka naxaasta ee korantada lagu shubay iyo wasakhowga sare ee xalka qashinka korantada.
Awoodda isku-xidhka ee u dhexeeya lakabka birta iyo dhoobada ayaa hooseeya, kalsoonida badeecaduna way yar tahay marka la isticmaalo.
