UMBUZO
  • I-High Thermal Conductivity AlN Ceramic Substrate
  • I-High Thermal Conductivity AlN Ceramic Substrate
  • I-High Thermal Conductivity AlN Ceramic Substrate
  • I-High Thermal Conductivity AlN Ceramic Substrate

I-High Thermal Conductivity AlN Ceramic Substrate

I-High Thermal Conductivity AlN Ceramic Substrate
  • Ukuminyana: 3.31 g/cm3
  • Amandla Acindezelayo: 2100 MPa
  • Ukuqina (Vickers): 11 GPa
  • IMINININGWANE YOMKHIQIZO

Incazelo Yomkhiqizo

 

I-Aluminium Nitride, ifomula i-AlN, iyinto entsha emndenini we-ceramics yobuchwepheshe. Nakuba ukutholakala kwayo kwenzeka eminyakeni eyi-100 edlule, iye yathuthukiswa yaba umkhiqizo okwaziyo ukuhwebelana onezindawo ezilawulwayo nezikwazi ukukhiqizwa phakathi neminyaka engama-20 edlule.


I-Aluminium nitride ine-hexagonal crystal structure futhi iyimpahla eboshiwe ehlangene. Ukusetshenziswa kwezinsiza-sintering nokucindezela okushisayo kuyadingeka ukuze kukhiqizwe impahla yebanga lobuchwepheshe eliminyene. Okubalulekile kuzinzile emazingeni okushisa aphezulu kakhulu emkhathini ongenayo. Emoyeni, i-oxidation yangaphezulu iqala ngaphezu kuka-700°C. Ungqimba lwe-aluminiyamu oxide lwakha amafomu oluvikela impahla kufika ku-1370°C. Ngaphezu kwaleli zinga lokushisa kwenzeka inqwaba ye-oxidation. I-Aluminium nitride izinzile ku-hydrogen ne-carbon dioxide emkhathini kuze kufike ku-980°C.


Izinto ezisetshenziswayo zincibilika kancane kuma-asidi amaminerali ngokuhlaselwa komngcele wokusanhlamvu, futhi kuma-alkali aqinile ngokuhlaselwa kwezinhlamvu ze-aluminum nitride. I-hydrolyzes kancane emanzini. Iningi lezinhlelo zokusebenza zamanje zisendaweni kagesi lapho ukususwa kokushisa kubalulekile. Lokhu okuqukethwe kuyathakazelisa njengenye indlela engenabuthi esikhundleni se-beryllia. Izindlela ze-Metallization ziyatholakala ukuze kuvunyelwe i-AlN ukuthi isetshenziswe esikhundleni se-alumina ne-BeO ezinhlelweni eziningi zikagesi

 

 Izakhiwo Zomzimba

 

 Izici ezinhle ze-dielectric

 High conductivity ezishisayo

 I-coefficient yokwandisa okushisayo ephansi, eduze naleyo ye-Silicon

 Ayisebenzi ngamakhemikhali namagesi enqubo ye-semiconductor evamile

 

Izinhlelo zokusebenza

 

 Osinki okushisa nezisakaza zokushisa

 Ama-insulators kagesi ama-lasers

 Ama-Chucks, izindandatho zokubopha zemishini yokucubungula i-semiconductor

 Ama-insulators kagesi

 Ukuphathwa kwe-Silicon wafer kanye nokucubungula

 Ama-substrates nama-insulators wamadivayisi e-microelectronic namadivayisi we-opto electronic

 Ama-substrates amaphakheji e-electronic

 Izithwali ze-chip zezinzwa nezitholi

 Ama-chiplets

 Ama-Collets

 Izingxenye zokulawula ukushisa kwe-laser

 Izinto zensimbi ezincibilikisiwe

 Amaphakheji amadivayisi we-microwave

Izinto ezibonakalayo


Omakhenikha

Amayunithi Wokulinganisa

I-SI/Metric

(Imperial)

Ukuminyana

gm/cc (lb/ft3)

3.26

-203.5

I-Porosity

% (%)

0

0

Umbala

impunga

Amandla e-Flexural

I-MPa (lb/in2x103)

320

-46.4

I-Elastic Modulus

I-GPa (lb/in2x106)

330

-47.8

Shear Modulus

I-GPa (lb/in2x106)

I-Bulk Modulus

I-GPa (lb/in2x106)

Isilinganiso sikaPoisson

0.24

-0.24

Amandla Acindezelayo

I-MPa (lb/in2x103)

2100

-304.5

Ukuqina

Kg/mm2

1100

Ukuqina Kokuphuka KIC

MPa•m1/2

2.6

Ubukhulu Bezinga Lokushisa Lokusebenzisa

°C (°F)

(awukho umthwalo)

Okushisayo




I-Thermal Conductivity

W/m•°K (BTU•in/ft2•ihora•°F)

140–180

(970–1250)

I-Coefficient of Thermal Expansion

10–6/°C (10–6/°F)

4.5

-2.5

Ukushisa Okuthize

J/Kg•°K (Btu/lb•°F)

740

-0.18

Ezogesi




Amandla e-Dielectric

ac-kv/mm (volts/mil)

17

-425

I-Dielectric Constant

@ 1 MHz

9

-9

I-Disipation Factor

@ 1 MHz

0.0003

-0.0003

I-Tangent yokulahlekelwa

@ 1 MHz

Ukumelana Nomthamo

ohm•cm

>1014



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