(DBC Ceramic subramic subrateByakozwe naWintrustek)
Umuringa utaziguye (DBC) Subramiteni ubwoko bushya bwibikoresho bigizwe nicyuma cy'umuringa cyahitanye ibintu bikabije (al2o3) cyangwa aluminium nitride (ALN) Suraramic. Ikoranabuhanga ryo hejuru ryikoranabuhanga rya Alumina na Aluminium Nitride Reramic surarate irasa. Gufata Al23 Jeramic Subramic nk'urugero, umuyoboro w'umuringa urimo gusudira mu buryo butaziguye mu buryo butaziguye mu rwego rwo gushyushya Ceramic mu kirere cya azote N2 irimo ogisijeni.
Ubushyuhe bushingiye ku bushyuhe (1065-1085) butera icyuma cy'umuringa kuri okiside, no gushonga ubuziranenge bw'umuringa, butuma umutwe w'icyuma, ugaragaza ibyuma bya ceramic; Noneho tegura umurongo usimbuza uburyo bwo hejuru ukurikije umurongo ushushanya umurongo wa firime. Byinshi bikoreshwa mubipfunyika byimbaraga Semiconductor Module, firigo nubushyuhe bwinshi bwimirire.
Inkwagu zumuzunguruko za mudasobwa hamwe nibikoresho byo murugo mubisanzwe bikoresha ibyuma nibice kama; Ariko, ibikoresho byerekana ceramic hamwe nimitungo myiza yubushyuhe, nka silicon nitride nziza, na aluminum, na alumina, irakenewe kugirango porogaramu zirenze urugero, porogaramu zigezweho, nkimbaraga za module, nabashinzwe ububasha, nabashinzwe ububasha, nabashinzwe imirire.
TheDbc substrateMu bubasha bwa elegitoronike ya elegitoroniki ni ubunini bwa chip itandukanye, imiyoboro ya diode, abatuba, ibigo bya sic, nibindi),Dbc substrateBinyuze hejuru yumuringa, kugirango urangize igice cya Chip igice cya pole cyangwa guhuza hejuru yihuza, imikorere isa niya pCB. Inshyingo ya DBC ifite ibintu byiza byo kwigira, imikorere myiza yubushyuhe, kurwanya ubushyuhe buke hamwe noguka hamwe na coefficient.
TheDbc substrateIfite ibi bikurikira bikurikira: Imikorere myiza yo kwirega, imikorere myiza yubushyuhe, guhuza ubushyuhe buke, guhuza ibikorwa bya kwaguka, imitungo myiza yubukanishi hamwe nubucuruzi bwiza.
1.. UkoreshejeDbc substrateNkibigo bya chip bitandukanya neza chip mubushyuhe bwa module, igice cya DBC hagati ya Al2O3 itezimbere neza ubushobozi bwa module ya module (ceramic lareyer voltage> 2.5KV).
2.5KV).2. Imyitwarire myiza yubushyuhe, TheDbc substrate
ifite imishinga myiza yubushyuhe hamwe na 20-260W / Mk, IGBT Module mubikorwa byo gukora, hejuru ya chip izabyara ubushyuhe bwimiterere ya module, kugirango urangize ubushyuhe bwa module, kugirango urangize ubushyuhe muri rusange module.
3. Umutekano w'amashanyarazi. Kubera ko umuringa ari icyuma kinyuranye cyane, amashanyarazi kirashobora gutwarwa no kurwanya bike urakoze kumurongo utaziguye hagati yumuringa na sustrate. Kubera iyo mpamvu, DBC ikwiranye nibyiza gukoreshwa mumashanyarazi yihuta y'amashanyarazi akeneye kohereza amakuru vuba kandi yizewe, harimo na mudasobwa na seriveri.4. Gutunganya kwaguka kwaDbc substrate
Irasa nubwa Chip.Ibisobanuro bya DBC yo kwaguka birasa niya silicon (7.1ppm / K), 20n / mm2. Byongeye kandi, ifite kandi imitungo myiza nubufatanye bwa gakondo. DBC ntabwo yoroshye kuyihindura, kandi irashobora gukoreshwa hejuru yubushyuhe bwinshi.5. Imikorere yo gusudira ni nziza. Imikorere yo gusudira yaDbc substrate
ni byiza. Ikigereranyo cyo kugurisha kiri munsi ya 5%, na DBC subtem ifite igiceri cy'umuringa cy'umuringa gishobora kwihanganira umutwaro wo hejuru. Ku gice kimwe, mubisanzwe bisaba 12% gusa byubugari bwa PCB, noneho birashobora kohereza imbaraga mubinini byo kunoza sisitemu nibikoresho byizewe. Bitewe n'imikorere yabo myiza, inyandiko zabo za DBC zikoreshwa cyane mugutegura ubwoko butandukanye bwibikoresho byingufu zishingiye ku butegetsi, cyane cyane ibikoresho byo gupakira.
