Kubikoresho bya elegitoroniki, ceramic substrate igira uruhare runini muguhuza imiyoboro yo gukwirakwiza imbere n’imbere, ndetse no guhuza amashanyarazi ndetse no gushyigikira imashini. Ceramic substrate ifite ibyiza byo gutwara ubushyuhe bwinshi, kurwanya ubushyuhe bwiza, imbaraga za mashini nyinshi, hamwe na coefficient nkeya yo kwagura ubushyuhe, kandi nibikoresho bisanzwe byububiko bwogupakira ibikoresho bya semiconductor.
Kubijyanye nimiterere nuburyo bwo gukora, ceramic substrate ishyirwa mubwoko 5.
Ubushyuhe bwo hejuru Bwifatanije na Multilayer Ceramic Substrates (HTCC)
Ubushyuhe Buke Bifatanije na Ceramic Substrates (LTCC)
Firime Yibumba Ceramic Substrates (TFC)
Umuringa Uhuza Umuringa Ceramic Substrates (DBC)
Umuringa ushyizwemo umuringa Ceramic Substrates (DPC)
Inzira zitandukanye
Directeur Bonded Copper (DBC) ceramic substrate ikorwa hongerwamo ogisijeni hagati yumuringa na ceramic kugirango ubone igisubizo cya e-eutectic Cu-O hagati ya 1065 ~ 1083 ℃, hanyuma hakurikiraho reaction yo kubona icyiciro giciriritse (CuAlO2 cyangwa CuAl2O4), bityo bikamenya guhuza imiti ya metallurgiki ya Cu plate na ceramic substrate, hanyuma amaherezo ukamenya gutegura igishushanyo mbonera cya tekinoroji ya lithographie kugirango ikore uruziga.
Coefficient yo kwagura ubushyuhe bwa substrate ya DBC yegereye cyane iy'ibikoresho bya LED epitaxial, bishobora kugabanya cyane imihangayiko yubushyuhe itangwa hagati ya chip na substrate.
Umuringa wububiko butaziguye (DPC) wububiko bwubutaka bukozwe mugusukaho umuringa kumurongo wubutaka bwa ceramic, hanyuma ugashyira ahagaragara, ugashiramo, ugafatwa amashusho, hanyuma amaherezo ukongera umubyimba wumurongo wumuringa ukoresheje amashanyarazi cyangwa isahani ya chimique, nyuma yo gukuraho uwifotora, umurongo w'icyuma urarangiye.
Inyungu zitandukanye nibibi
Ibyiza bya DBC Ceramic Substrate
Kubera ko umuringa wumuringa ufite amashanyarazi meza nubushyuhe, DBC ifite ibyiza byo gutwara neza ubushyuhe, kubika neza, kwizerwa cyane, kandi yakoreshejwe cyane mubikoresho bya IGBT, LD, na CPV. Cyane cyane kubera ifu yumuringa mwinshi (100 ~ 600μm), ifite ibyiza bigaragara mubijyanye no gupakira IGBT na LD.
Ibibi bya DBC Ceramic Substrate
Igikorwa cyo kubyaza umusaruro gikoresha eutectic reaction hagati ya Cu na Al2O3 mubushyuhe bwinshi, bisaba urwego rwo hejuru rwibikoresho byo kubyaza umusaruro no kugenzura ibikorwa, bityo bigatuma igiciro kiri hejuru.
Bitewe nigisekuru cyoroshye cya microporosity hagati ya Al2O3 na Cu, bigabanya ubukana bwumuriro wibicuruzwa, izo ngaruka ziba icyuho cyo kuzamura DBC substrate.
Ibyiza bya DPC Ceramic Substrate
Uburyo bwo hasi yubushyuhe (munsi ya 300 ° C) burakoreshwa, birinda rwose ingaruka mbi zubushyuhe bwo hejuru kubintu cyangwa umurongo, kandi bikanagabanya ikiguzi cyibikorwa byo gukora.
Gukoresha firime yoroheje na tekinoroji ya Photolithography, kugirango substrate kumurongo wumurongo wicyuma, bityo substrate ya DPC nibyiza muguhuza ibisabwa bihanitse kugirango bapakire ibikoresho bya elegitoroniki.
Ibibi bya DPC Ceramic Substrate
Ubunini buke bwumuriro wumuringa wabitswe hamwe numwanda mwinshi wumuti wa electroplating.
Imbaraga zo guhuza hagati yicyuma na ceramic ziri hasi, kandi kwizerwa kwibicuruzwa ni bike iyo bishyizwe mubikorwa.
