Maka nkwakọ ngwaahịa eletrọnịkị, ihe ndị na-emepụta seramiiki na-arụ ọrụ dị mkpa n'ijikọta ọwa ikposa ọkụ dị n'ime na nke dị n'èzí, yana ma njikọ eletrik na nkwado igwe. Mkpụrụ seramiiki nwere uru nke ịdị elu thermal conductivity, ezigbo nguzogide okpomọkụ, ike ọrụ dị elu, yana ọnụ ọgụgụ dị ala nke mgbasawanye thermal, na ha bụ ihe ndị a na-ahụkarị maka nkwakọ ngwaọrụ semiconductor ike.
N'ihe gbasara nhazi na usoro mmepụta ihe, a na-ekewa ihe ndị na-emepụta seramiiki n'ime ụdị ise.
Ngwakọta seramiiki Multilayer nke dị elu (HTCC)
Ngwakọta seramiiki na-ekpo ọkụ dị ala (LTCC)
Ngwa seramiiki ihe nkiri (TFC)
Ngwakọta ọla kọpa kwụ ọtọ (DBC)
Ngwakọta ọla kọpa Direct Plated (DPC)
Usoro mmepụta dị iche iche
A na-emepụta mkpụrụ seramiiki Direct Bonded Copper (DBC) site n'ịgbakwunye oxygen n'etiti ọla kọpa na seramiiki iji nweta ngwọta Cu-O eutectic n'etiti 1065 ~ 1083℃, na-esote mmeghachi omume iji nweta oge etiti (CuAlO2 ma ọ bụ CuAl2O4), si otú a na-achọpụta ngwakọta metallurgical kemịkalụ. nke Cu efere na seramiiki mkpụrụ, na n'ikpeazụ na-aghọta graphic nkwadebe site lithography technology na-etolite sekit.
Ọnụ ọgụgụ mgbasawanye okpomọkụ nke mkpụrụ nke DBC dị nnọọ nso na nke ihe epitaxial LED, nke nwere ike ibelata nrụgide okpomọkụ na-ebute n'etiti mgbawa na mkpụrụ.
Direct Plated Copper (DPC) ceramic substrate ka a na-eme site n'ịwụsa oyi akwa ọla kọpa na mkpụrụ seramiiki ahụ, wee kpughee, etched, mebie ihe nkiri, na n'ikpeazụ ịbawanye ọkpụrụkpụ nke ahịrị ọla kọpa site na itinye electroplating ma ọ bụ kemịkalụ kemịkalụ, mgbe iwepu fotoresisist, metalized akara emecha.
Uru na ọghọm dị iche iche
Uru nke DBC Ceramic Substrate
Ebe ọ bụ na foil ọla kọpa nwere ezigbo ọkụ eletrik na ọkụ ọkụ, DBC nwere uru nke ezigbo ọkụ ọkụ, ezigbo mkpuchi, ntụkwasị obi dị elu, ma ejiri ya mee ihe na ngwugwu IGBT, LD, na CPV. Karịsịa n'ihi foil ọla kọpa (100 ~ 600μm), ọ nwere uru doro anya n'ọhịa nke nkwakọ ngwaahịa IGBT na LD.
Ọdịmma nke DBC Serramic Substrate
Usoro mmepụta ahụ na-eji mmeghachi omume eutectic dị n'etiti Cu na Al2O3 na okpomọkụ dị elu, nke na-achọ ọkwa dị elu nke mmepụta ngwá ọrụ na njikwa usoro, si otú a na-eme ka ọnụ ahịa dị elu.
N'ihi ọgbọ dị mfe nke microporosity n'etiti Al2O3 na Cu oyi akwa, nke na-ebelata nguzogide ujo nke ngwaahịa ahụ, adịghị ike ndị a na-aghọ ihe mgbochi nke nkwalite mkpụrụ nke DBC.
Uru nke DPC Sermik Substrate
A na-eji usoro okpomọkụ dị ala (n'okpuru 300 Celsius C) mee ihe, nke na-ezere kpamkpam mmetụta ọjọọ nke okpomọkụ dị elu na ihe onwunwe ma ọ bụ usoro ahịrị, ma na-ebelata ọnụ ahịa nke usoro mmepụta ihe.
The ojiji nke mkpa film na photolithography technology, nke mere na mkpụrụ na metal akara finer, otú DPC mkpụrụ bụ ezigbo maka itinye n'ọnọdụ nke elu nkenke chọrọ maka nkwakọ nke ngwá electronic.
Ọdịmma nke DPC ceramic Substrate
Oke okpokolo agba nke akwa ọla kọpa edobere na oke mmetọ nke ngwọta mkpofu electroplating.
Ike njikọ dị n'etiti oyi akwa metal na seramiiki dị ala, na ntụkwasị obi nke ngwaahịa ahụ dị ala mgbe etinyere ya.
