In metal forming work, silicon nitride ceramic extrusion is used to extrude and draw copper, brass, and nimonic alloys. Because of its exceptional resistance to wear, corrosion, and thermal shock, the die lasts longer and requires less maintenance.

Direct Bonded Copper (DBC) ceramic substrates are a new type of composite material in which copper metal is coated on a highly insulating alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate.

An established method for bonding ceramics, brazing is a liquid phase procedure that works especially well for creating joints and seals. Components used in the electronics and automotive industries, for example, can easily be mass-produced using the brazing technique.

Alumina is a good material for ball valves, piston pumps, and deep drawing tools because of its high hardness and good resistance to wear. Additionally, brazing and metalizing processes make it simple to combine with metals and other ceramic materials.

N'ihi ihe ndị pụrụ iche, Sic bụ ihe dị mma maka ngwa ike chọrọ iji ngwa dị elu chọrọ oke okpomọkụ, ịdị elu na-adị ugbu a, na nnukwu ikuku.Sic apụtawo dị ka nnukwu ọrụ na azụmaahịa Semiconductor, na-enye ike iji ike modulu, schottky diodides, na Mosfets maka iji ọrụ dị elu, ngwa ike.Ọzọkwa, Sic nwere ike ijikwa Fultivings na-arụ ọrụ

A na-arụ ọrụ carbide na ike semiconductor nwere ike rụọ ọrụ dị ka ihe na - eme ka ọ dị oke mmachi, yana windo nkesa gas, yana Windows plọg na mpaghara semiconductor.

Aluminium nitride bụ seramic na ikuku ikuku na eletriki. Omume oke ikuku ya siri ike na-eme ya ihe a ma ama maka semiconductor. Ọzọkwa, ọ bụ nhọrọ dị mma maka ọdịiche dị iche iche n'ihi mgbasawanye na-agbasawanye ọnụ ala na nguzosi ike oxidation. N'ihi nnukwu nguzogide na kemịkal, aluminom nitride bụ ihe nke liki

Ogwe aka nke 99.8% seramic akwa mkpuchi bu ihe eji eme ihe na usoro nmepụta semiconductor. A na-ejikarị mkpuchi nke seramiiki dị mma na akụrụngwa dị mma na-arụ ọrụ dị iche iche, na-eme ka ọ dabara na ngwa semiconductor dị iche iche.

Ngwa ụfọdụ maka ngwaahịa silicon nitraride na ụlọ ọrụ mmanụ

The Si3N4 egweri bọọlụ siri ike thermal nkwụsi ike na-eme ka ọ dabara adaba maka ojiji na elu okpomọkụ na cryogenic egweri Filiks. Nguzogide okpomọkụ pụrụiche nke bọọlụ ahụ na-enye ya ohere ịtachi obi na mgbanwe okpomọkụ na-enweghị atụfu ọrụ ya ma ọ bụ ụdị ya. Ọ dị 60% dị ọkụ karịa ígwè, na-agbasawanye obere okpomọkụ, ma nwee obere ụgwọ ọrụ n'ozuzu ya ma e jiri ya tụnyere usoro ndị ọzọ na-egweri.