(DBC Ceramic SubstrateTsim los ntawmWintrustek)
Tus conder ncaj qha (DBC) Ceramic substratesYog hom khoom tshiab ntawm cov khoom siv liab uas yog cov hlau liab hlau yog coated ntawm ib tug heev insulating alumina (alno3) los yog aluminium nitride (aln) substrate. Cov nplaim hluav taws xob me me ntawm alumina thiab txhuas nitride ceramic substrates yuav luag zoo ib yam. Noj lub Al2o3 Cleamic substrate ua piv txwv, cu tooj liab ntawv los ntawm alumina submitate n2 muaj oxygen.
Ib puag ncig cua sov ntawm kev kub siab (1065-105) ua rau lub tooj liab canidize, diffuse, uas ceramic submate thiab tsim cov ceramic perosite ittrate; Tom qab ntawd npaj cov kab substrate los ntawm etching txoj kev raws li txoj kab kev tsim duab ua yeeb yaj kiab zaj duab xis. Mas siv nyob rau hauv lub ntim ntawm cov hwj huam sicemonductor modules, tub yees thiab ntsuas kub.
Circuit Court boards ntawm cov khoos phis tawj thiab cov khoom siv hluav taws xob tsawg feem ntau siv hlau thiab cov organic substrates; Txawm li cas los xij, Ceramic Substrate cov ntaub ntawv nrog cov khoom siv thermal zoo dua, thiab alumina, xws li cov khoom siv hluav taws xob siab, xws li cov khoom siv hluav taws xob siab, thiab cov kev tswj hwm hnub ci.
TusDbc substratenyob rau hauv lub hwj huam hauv hluav taws xob module yog feem ntau yog ntau yam chips (aws chips, diode chips, tsim tawm, sic chips, thiab lwm yam), tusDbc substrateLos ntawm tooj liab txheej deg nto, kom tiav cov nti ib feem ntawm kev sib txuas ncej lossis txuas rau saum npoo ntawm kev sib txuas, txoj haujlwm zoo ib yam li ntawm PCB substrate. DBC substrate muaj cov khoom siv insulating zoo, kev kub kub disspipation kev ua haujlwm, qis thermal kuj thiab sib luag nthuav dav coefficient.
TusDbc substrateMuaj cov yam ntxwv zoo hauv qab no: Cov kev ua tau zoo hauv qab no, cov cua sov tsis txaus ntseeg, cov khoom siv hluav taws xob tsawg, cov kws kho mob zoo thiab kev ua haujlwm zoo.
1. Cov tshuaj insulating zoo. Siv covDbc substrateRaws li lub nti pab txhawb tau zoo sib cais tau cais tawm ntawm module lub tshav kub dissipation embupating, Ceramic Txheej Rwb thaiv tsev voltage> 2.5KV).
2.5KV).2. Zoo heev thermal conductivity, tusDbc substrate
Muaj cov thermal zoo tshaj plaws nrog ntawm 20-260W / MK, igBT chaw ua haujlwm los ntawm cov khoom lag luam silicon ntawm lub pob ua ke, kom tiav tag nrho cov cua sov ntws ntawm module.
3. Kev ua tau hluav taws xob zoo heev. Txij li tooj liab yog cov teeb meem hlau ua ke, cov cim hluav taws xob tuaj yeem nqa nrog kev sib txuas me me ua tsaug rau qhov ncaj qha ntawm tooj liab thiab substrate. Vim tias qhov no, DBC yog qhov zoo tshaj plaws rau kev siv hauv cov khoom siv hluav taws xob nrawm uas yuav tsum tau xa cov ntaub ntawv kom nrawm thiab ntseeg tau, suav nrog lub khoos phis tawj thiab cov servers.4. Lub zog nthuav dav ntawm lubDbc substrate
yog zoo li ntawm lub chip.Qhov dbc substrate tus coefficient ntawm expicon (7.1pplm / k), uas yuav tsis muaj kev ntxhov siab rau cov silicon (7.1pp Dhau li, nws tseem muaj cov khoom siv zoo thiab corrosion tsis kam. DBC tsis yooj yim rau deform, thiab tuaj yeem siv ntau dua qhov kub thiab txias ntau.5. Vuam kev ua tau zoo. Kev ua haujlwm vuam ntawm lubDbc substrate
yog qhov zoo. Cov soluting void piv yog tsawg dua 5%, thiab dbc substrate muaj ib txheej tooj liab tooj liab uas tuaj yeem tiv thaiv tau ib qho kev thauj khoom zoo heev. Nyob rau tib tus hneev taw ib yam, nws yuav tsum tsuas yog 12% ntawm PCB cov kev coj ua dav dav, tom qab ntawd tuaj yeem kis hluav taws xob ntau rau hauv ib lub ntim ntim los txhim kho cov tshuab thiab khoom siv kev ntseeg tau. Vim lawv cov kev ua tau zoo heev, dbc substrates tau siv dav hauv kev npaj ntawm ntau hom hluav taws xob siab, tshwj xeeb yog cov ntaub ntawv ntim ntim kaw.
