High-temperature refractory ceramic khoom 3YSZ, los yog qhov peb tuaj yeem hu ua tetragonal zirconia polycrystal (TZP), yog ua los ntawm zirconium oxide uas tau ruaj khov nrog 3% mol yttrium oxide.

Cov khoom siv uas tsis yog xim hlau muaj xws li silicon thiab nitrogen, silicon nitride (Si3N4) kuj yog cov khoom siv ceramic zoo tshaj plaws nrog kev sib xyaw ua ke ntawm txhua yam, thermal, thiab hluav taws xob. Tsis tas li ntawd, piv rau lwm cov ceramics feem ntau, nws yog cov khoom siv ua haujlwm siab nrog cov thermal expansion coefficient uas muaj cov thermal shock kuj zoo heev.

Pyrolytic BN lossis PBN yog luv rau pyrolytic boron nitride. Nws yog ib hom hexagonal boron nitride tsim los ntawm cov tshuaj vapor deposition (CVD) txoj kev, kuj yog ib qho ntshiab boron nitride uas muaj peev xwm ncav cuag ntau tshaj 99.99%, npog yuav luag tsis muaj porosity.

Silicon carbide (SiC) yog cov khoom siv ceramic uas nquag loj hlob raws li ib qho siv lead ua rau kev siv semiconductor. Vim nws cov khoom siv hauv paus ntsiab lus thiab kev loj hlob ib leeg-crystal, nws yog ib qho ntawm cov khoom siv hluav taws xob ruaj khov tshaj plaws ntawm kev ua lag luam. Qhov no durability ncua deb tshaj nws cov hluav taws xob functionality.

Boron Nitride (BN) ceramics yog cov zoo tshaj plaws-qib ceramics. Lawv muab cov khoom tshwj xeeb kub-tiv taus, xws li thermal conductivities, siab dielectric zog thiab tshwj xeeb tshuaj inertness los daws cov teeb meem nyob rau hauv ib co ntawm lub ntiaj teb no feem ntau xav tau daim ntawv thov.

Substrates ua los ntawm nyias zaj duab xis ceramic kuj raug xa mus rau cov khoom siv semiconductor. Nws yog tsim los ntawm ib tug xov tooj ntawm cov txheej nyias nyias uas tau tsim los siv lub tshuab nqus tsev txheej, deposition, los yog sputtering txoj kev. Cov ntawv iav nrog lub thickness tsawg tshaj li ib millimeter uas yog ob-dimensional (flat) los yog peb-dimensional yog suav tias yog nyias-film ceramic substrates. Lawv tuaj yeem tsim los ntawm v

Thaum Si3N4 ua ke zoo heev thermal conductivity thiab mechanical kev ua tau zoo. Cov thermal conductivity tuaj yeem teev tau ntawm 90 W / mK, thiab nws cov tawv nqaij tawg yog qhov siab tshaj plaws ntawm cov khoom sib piv. Cov yam ntxwv no qhia tias Si3N4 yuav nthuav tawm qhov kev ntseeg siab tshaj plaws raws li cov khoom siv hlau.

Boron nitride ceramics muaj lub zog zoo tshaj plaws thiab kev ua haujlwm thermal uas zoo heev ruaj khov, ua rau lawv yog qhov kev xaiv zoo tshaj plaws los ua cov nozzles uas siv rau hauv atomization ntawm molten hlau.

Boron Carbide (B4C) yog cov khoom siv ruaj khov uas muaj boron thiab carbon. Boron Carbide yog ib qho nyuaj tshaj plaws uas paub, qeb thib peb tom qab cubic Boron nitride thiab pob zeb diamond. Nws yog cov khoom siv sib xyaw ua ke siv ntau yam kev siv tseem ceeb, suav nrog cov khoom siv phom sij, cov tsho tiv thaiv cov mos txwv, thiab cov cav tov hmoov av. Qhov tseeb, nws yog cov khoom siv rau ntau yam kev siv hauv kev lag luam

High thermal conductivity thiab qis coefficient ntawm thermal expansion. Qhov kev sib xyaw ua ke ntawm cov khoom no muab qhov tshwj xeeb thermal shock tsis kam, ua rau Silicon Carbide ceramics pab tau ntau yam kev lag luam. Nws kuj yog ib qho semiconductor thiab nws cov khoom hluav taws xob ua rau nws haum rau ntau yam kev siv. Nws kuj tseem paub txog nws qhov hnyav hardness thiab corrosion kuj.