Don marufi na lantarki, yumburan yumbu suna taka muhimmiyar rawa wajen haɗa tashoshi masu rarraba zafi na ciki da na waje, da kuma haɗin haɗin lantarki da goyon bayan inji. Substrates yumbura suna da fa'idodin haɓakar haɓakar thermal, kyakkyawan juriya mai zafi, ƙarfin injina, da ƙarancin haɓakar haɓakar thermal, kuma su ne kayan aikin gama gari don marufi na na'urar semiconductor.
Dangane da tsari da tsarin masana'antu, ana rarraba kayan yumbura zuwa nau'ikan 5.
Babban Haɗin Zazzaɓi Haɗe-haɗe na yumbura (HTCC)
Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙaƙwalwa
Kauri Fim Substrates (TFC)
Rubutun yumbura na Tagulla kai tsaye (DBC)
Rubutun Tagulla Kai tsaye Ceramic Substrates (DPC)
Hanyoyin samarwa daban-daban
Direct Bonded Copper (DBC) yumbu substrate ana samarwa ta hanyar ƙara iskar oxygen tsakanin jan karfe da yumbu don samun maganin Cu-O eutectic tsakanin 1065 ~ 1083 ℃, sannan amsawa don samun tsaka-tsakin lokaci (CuAlO2 ko CuAl2O4), don haka fahimtar haɗin ƙarfe na sinadarai. na Cu farantin karfe da yumbu substrate, sa'an nan kuma a karshe gane mai hoto shirye-shirye ta lithography fasahar samar da kewaye.
Matsakaicin haɓakar haɓakar thermal na DBC substrate yana kusa da na kayan epitaxial na LED, wanda zai iya rage yawan zafin zafi da aka haifar tsakanin guntu da ma'aunin.
Direct Plated Copper (DPC) ana yin yumbu ta hanyar watsa wani Layer na tagulla akan yumbura, sannan a fallasa, tarkace, cire fim, sannan a ƙara kauri na layin tagulla ta hanyar sanya wutan lantarki ko sinadarai, bayan cire hoton, An kammala layin ƙarfe.
Fa'idodi daban-daban da rashin amfani
Amfanin DBC Ceramic Substrate
Tun da murfin jan ƙarfe yana da wutar lantarki mai kyau da haɓakar thermal, DBC yana da fa'idodi na kyawawan halayen thermal, insulation mai kyau, babban abin dogaro, kuma an yi amfani dashi sosai a cikin fakitin IGBT, LD, da CPV. Musamman saboda kauri mai kauri (100 ~ 600μm), yana da fa'ida a fili a fagen IGBT da LD marufi.
Lalacewar DBC Ceramic Substrate
Tsarin samarwa yana amfani da halayen eutectic tsakanin Cu da Al2O3 a yanayin zafi mai zafi, wanda ke buƙatar babban matakin kayan aiki da sarrafa tsari, don haka ya sa farashin ya yi girma.
Saboda sauƙin ƙarni na microporosity tsakanin Layer Al2O3 da Cu, wanda ke rage juriya na girgizar zafi na samfur, waɗannan rashin lahani sun zama ƙaƙƙarfan ƙaƙƙarfan haɓakar ƙaramar DBC.
Fa'idodin DPC Ceramic Substrate
Ana amfani da tsarin ƙananan zafin jiki (a ƙasa 300 ° C), wanda gaba ɗaya ya guje wa mummunan tasirin zafi mai zafi a kan kayan aiki ko tsarin layi, kuma yana rage farashin tsarin masana'antu.
Yin amfani da fina-finai na bakin ciki da fasaha na photolithography, don haka substrate a kan layin karfe mai kyau, don haka DPC substrate yana da kyau don daidaitawa na madaidaicin buƙatun don marufi na na'urorin lantarki.
Lalacewar DPC Ceramic Substrate
Iyakance kauri na electroplated ajiyan jan karfe da kuma babban gurbataccen bayani na sharar gida.
Ƙarfin haɗin kai tsakanin karfen ƙarfe da yumbura yana da ƙasa, kuma amincin samfurin yana da ƙananan lokacin amfani.
