(DBC Ceramic SubstrateInogadzirwa naWintrustek)
Direct yakasungwa mhangura (DBC) ceramic sentsMhando idzva yezvinyorwa zvemhando yemasimbi iyo mangozi yemhangura yakafukidzwa neyakawandisa alumina (Al2o3) kana aluminium nitride (Aln) Substrate. Iyo SEASE YEMADZIMAI Tekinoroji yeAlumina naAluminium Nitreide Ceramic Sevents yakangofanana. Kutora iyo Al2o3 ceramic substrate semuenzaniso, iyo copper foil yakanangana neAlumina substrate nekudziya substrate muNitrogen mamiriro ezvinhu N2 ine oksijeni.
Kusimbisa kwezvakatipoteredza tembiricha (1065-1085) Inokonzera simbi yemhangura ku oxidize, inoshungurudza eutectic, inosungira mhangura uye inogadzira substrate uye inogadzira ceramic centrate substrate; Wobva wagadzirira mutsara wetsiva neyekutora nzira zvichienderana neyemutsetse dhizaini kuratidzwa kwefirimu rekuvandudza firimu. Inonyanya kushandiswa mumatanho eSimba Semiconductor Modules, mafiriji uye hombe tembiricha zvisimbiso.
Matombo edunhu emakomputa uye akaderera-simba epamba zvishandiso zvinowanzo shandisa simbi uye organc simbisa; Nekudaro, zvinyoronyoro zvinoratidza zvinhu zviri nani zvekupisa zvivakwa, zvakadai se silicon nitride, aluminium nitride, uye alumina, zviyero zvepamusoro, zvakaita soMasimba manyoro, solar marara, uye vatambi vemota.
The theDBC SubstrateMune Simba Magetsi Modulle Tekinoroji inonyanya kusarudzika machipisi (IGBT Chips, Diode Chips, Resisters, Sic Chips, nezvimwewo), iyoDBC SubstrateKuburikidza neiyo mhangura inovhara nzvimbo, kuti upedze chipenga chechipfuva chekubatanidza pole kana kubatanidza pamusoro pehukama, basa rakafanana neiyo PCB substrate. Iyo DBC Substrate ine yakanaka yekuchinja zvivakwa, yakanaka kupisa kusagadzikana kuita, yakaderera inodziya kupesana uye kuwanda kwekuwedzera kuwanda.
The theDBC SubstrateIine zvinotevera zvinhu zvakatanhamara: Kubata kwakanaka kwekunzwa, kupisa kwekupedza kupokana, kupokana kwekuwedzera, kufananidza michero yekuwedzera, kuita kwakanaka kuita uye kutengesa kwakanaka.
1. Kuita kwakanaka kwekuchinja. Uchishandisa iyoDBC SubstrateSekutsigira kweChip zvinobudirira kupatsanura chipenga kubva kuModule Kuputsa, iyo DBC Substirate
2. Yakanakisa inobata, iyoDBC SubstrateIne yakanakisa yekubatanidza ne20-260W / mk, mk
3. magetsi akasarudzika maitiro. Sezvo mhangura yesimbi inosimbisa, masairwi emagetsi anogona kutakurwa nekupokana kushoma nekuda kwekubatana kwakananga pakati pemhangura uye substrate. Nekuda kweizvi, DBC yakanaka yakakodzera kushandiswa mune yakakwira midziyo yemagetsi iyo inoda kutapurudzira data nekukurumidza uye nekuvimbika, kusanganisira makomputa uye maseva.
4. Kuwedzeredza kuenderana neDBC SubstrateZvakafanana neiyo chip.The DBC Subcess yekuwedzera kwakafanana neiyo silicon) (7.1ppm Kunze kwezvo, zvakare zvine mitezo yakanaka yemakaniki uye kupokana kwekubata. DBC hazvisi nyore kushomeka, uye inogona kushandiswa pamusoro pekushambadzira kwakakura.
5. Welding maitiro akanaka. Mashandiro awoDBC Substrateyakanaka. Iyo inotengeserura void ratio isingasviki 5%, uye iyo DBC Substrate ine iyo thicker yendarira denderedzwa iyo inogona kutsungirira yakanyanya kuwanda. Pane imwecheteyo cross-chikamu, chinowanzoda chete gumi nemaviri muzana yePCB's yePCB yakafara, saka inogona kuendesa mamwe masimba mune yeyuniti vhoriyamu yekuvandudza hurongwa nemidziyo kuvimbika. Nekuda kwekuita kwavo kwakanaka, DBC Sukwenzi inoshandiswa zvakanyanya mukugadzirira kwemhando dzakasiyana-siyana dzezvemhando dzakakwirira-dzemagetsi (kunyanya igbt kurongedza zvinhu.
6. Yakanyanya kusimba uye yakareba-yakawanda. Muzvishandiso zvehondo uye neAerospace apo zvishandiso zvemagetsi zvinofanirwa kupona zvakanyanyisa mamiriro, chinongedzo chakananga pakati pemhangura uye substrate chinoburitsa chimiro chakasimba, chakaomarara chinogona kukanganisa nharaunda dzinobata uye dzinotyisa nharaunda.
