Zvekurongedza zvemagetsi, ma substrates e ceramic anoita basa rakakosha mukubatanidza nzira dzemukati nekunze dzekupisa kupisa, pamwe nekubatanidza magetsi uye kutsigirwa kwemagetsi. Ceramic substrates ine mabhenefiti ekukwirira kwemafuta ekupisa, kunaka kwekupisa kupisa, kusimba kwemagetsi, uye yakaderera coefficient yekuwedzera kwekupisa, uye ndiwo akajairika substrate zvinhu zvesimba semiconductor mudziyo kurongedza.
Panyaya yemaitiro uye maitiro ekugadzira, ceramic substrates inoiswa mumhando 5.
High-Temperature Co-fired Multilayer Ceramic Substrates (HTCC)
Low-Temperature Co-fired Ceramic Substrates (LTCC)
Makobvu Firimu Ceramic Substrates (TFC)
Direct Bonded Copper Ceramic Substrates (DBC)
Direct Plated Copper Ceramic Substrates (DPC)
Maitiro Akasiyana-siyana ekugadzira
Direct Bonded Copper (DBC) ceramic substrate inogadzirwa nekuwedzera oxygen pakati pemhangura neceramic kuti iwane Cu-O eutectic solution pakati pe1065~1083℃, inoteverwa nekuita kuwana chikamu chepakati (CuAlO2 kana CuAl2O4), zvichibva zvaona kusanganiswa kwekemikari yesimbi. yeCu plate uye ceramic substrate, uyezve pakupedzisira kuona iyo graphic kugadzirira ne lithography tekinoroji kugadzira dunhu.
Iyo yekupisa yekuwedzera coefficient yeDBC substrate iri padyo neiyo ye LED epitaxial zvinhu, izvo zvinogona kuderedza zvakanyanya kushushikana kwekupisa kunogadzirwa pakati pechip uye substrate.
Direct Plated Copper (DPC) ceramic substrate inogadzirwa nekupfapfaidza mhangura pamusoro peceramic substrate, yobva yafumura, yakamiswa, yakadhirowa, uye pakupedzisira kuwedzera kukora kwetambo yemhangura ne electroplating kana kemikari plating, mushure mekubvisa photoresist, metalized line inopedzwa.
Zvakasiyana Zvakanakira uye Zvakaipa
Zvakanakira zveDBC Ceramic Substrate
Sezvo foil yemhangura iine yakanaka magetsi uye yekupisa conductivity, DBC ine zvakanakira yeakanaka thermal conductivity, yakanaka insulation, yakakwirira kuvimbika, uye yakashandiswa zvakanyanya muIGBT, LD, uye CPV mapakeji. Kunyanya nekuda kwekukora mhangura foil (100 ~ 600μm), ine mabhenefiti ari pachena mumunda weIGBT uye LD kurongedza.
Zvakaipa zveDBC Ceramic Substrate
Maitiro ekugadzira anoshandisa eutectic reaction pakati peCu neAl2O3 pakupisa kwakanyanya, izvo zvinoda mwero wepamusoro wezvigadzirwa zvekugadzira uye kutonga kwemaitiro, nekudaro zvichiita kuti mutengo ukwire.
Nekuda kweiyo nyore chizvarwa che microporosity pakati peAl2O3 neCu layer, iyo inoderedza kupisa kwekuvhunduka kwechigadzirwa, izvi zvisingabatsiri zvinova bhodhoro reDBC substrate kukwidziridzwa.
Zvakanakira zveDPC Ceramic Substrate
Iyo yakaderera-yekupisa nzira (pasi pe300 ° C) inoshandiswa, iyo inodzivisa zvachose kukanganisa kwakashata kwekushisa kwepamusoro pane zvinyorwa kana mutsara wekugadzira, uye inoderedzawo mari yekugadzira.
Kushandiswa kwefirimu yakaonda uye photolithography tekinoroji, kuitira kuti iyo substrate pamutsara wesimbi inonatsa, saka iyo DPC substrate yakanakira kurongeka kweiyo yakakwirira chaiyo zvinodiwa pakurongedza zvemagetsi zvigadzirwa.
Zvakaipa zveDPC Ceramic Substrate
Ukobvu hushoma hwe electroplated yakaiswa mhangura layer uye kusvibiswa kwakanyanya kwe electroplating waste solution.
Simba rekubatanidza pakati pesimbi yesimbi uye ceramic yakaderera, uye kuvimbika kwechigadzirwa kwakaderera kana kuchishandiswa.
