Pakuyika pamagetsi, magawo a ceramic amatenga gawo lalikulu pakulumikiza njira zochotsera kutentha kwamkati ndi kunja, komanso kulumikizana kwamagetsi ndi chithandizo chamakina. Magawo a Ceramic ali ndi mwayi wokhala ndi matenthedwe apamwamba kwambiri, kukana kutentha kwabwino, kulimba kwamakina apamwamba, komanso kutsika kwapang'onopang'ono kwa kukulitsa kwamafuta, ndipo ndizomwe zimagwiritsidwa ntchito pagawo lamagetsi lamagetsi amagetsi a semiconductor.
Pankhani yamapangidwe ndi kupanga, magawo a ceramic amagawidwa m'mitundu 5.
High-Temperature Co-fired Multilayer Ceramic Substrates (HTCC)
Low-Temperature Co-fired Ceramic Substrates (LTCC)
Thick Film Ceramic Substrates (TFC)
Direct Bonded Copper Ceramic Substrates (DBC)
Direct Plated Copper Ceramic Substrates (DPC)
Njira Zopangira Zosiyanasiyana
Direct Bonded Copper (DBC) ceramic substrate imapangidwa powonjezera mpweya pakati pa mkuwa ndi ceramic kuti mupeze yankho la Cu-O eutectic pakati pa 1065 ~ 1083 ℃, kutsatiridwa ndi zomwe mungachite kuti mupeze gawo lapakati (CuAlO2 kapena CuAl2O4), potero kuzindikira kuphatikiza kwazitsulo zazitsulo. wa Cu mbale ndi ceramic gawo lapansi, ndiyeno potsiriza kuzindikira likutipatsa kukonzekera ndi lithography luso kupanga dera.
Kuchuluka kwa kutentha kwa gawo lapansi la DBC kuli pafupi kwambiri ndi zida za LED epitaxial, zomwe zingachepetse kwambiri kupsinjika kwa kutentha komwe kumapangidwa pakati pa chip ndi gawo lapansi.
Direct Plated Copper (DPC) gawo laceramic limapangidwa ndi kuwaza wosanjikiza wa mkuwa pa ceramic substrate, kenako kumaonekera, kuzikika, kujambulidwa, ndipo potsirizira pake kukulitsa makulidwe a mzere wa mkuwa ndi electroplating kapena chemical plating, pambuyo pochotsa photoresist, mzere wazitsulo watsirizidwa.
Ubwino Wosiyanasiyana ndi Zoipa
Ubwino wa DBC Ceramic Substrate
Popeza zojambula zamkuwa zimakhala ndi magetsi abwino komanso matenthedwe, DBC ili ndi ubwino wa kayendedwe kabwino ka kutentha, kutsekemera kwabwino, kudalirika kwakukulu, ndipo yakhala ikugwiritsidwa ntchito kwambiri mu IGBT, LD, ndi CPV phukusi. Makamaka chifukwa cha zojambulazo zokulirapo zamkuwa (100 ~ 600μm), zili ndi zabwino zodziwikiratu m'munda wa IGBT ndi LD ma CD.
Kuipa kwa DBC Ceramic Substrate
Njira yopangira imagwiritsa ntchito njira ya eutectic pakati pa Cu ndi Al2O3 pa kutentha kwakukulu, komwe kumafuna zipangizo zamakono zopangira ndi kuwongolera ndondomeko, motero kumapangitsa mtengo kukhala wokwera.
Chifukwa cha m'badwo wosavuta wa microporosity pakati pa Al2O3 ndi Cu wosanjikiza, zomwe zimachepetsa kukana kwamafuta kwa chinthucho, zovuta izi zimakhala nkhokwe ya kukwezedwa kwa gawo la DBC.
Ubwino wa DPC Ceramic Substrate
Njira yochepetsera kutentha (pansi pa 300 ° C) imagwiritsidwa ntchito, yomwe imapewa kwathunthu zotsatira za kutentha kwapamwamba pazitsulo kapena mzere wa mzere, komanso zimachepetsanso mtengo wa kupanga.
Kugwiritsa ntchito filimu woonda ndi luso photolithography, kotero kuti gawo lapansi pa zitsulo mzere bwino, kotero gawo lapansi DPC ndi abwino kwa mayikidwe zofunika mkulu mwatsatanetsatane ma CD zipangizo zamagetsi.
Kuipa kwa DPC Ceramic Substrate
Limited makulidwe a electroplated waikamo mkuwa wosanjikiza ndi mkulu kuipitsa electroplating zinyalala njira.
Mphamvu yolumikizana pakati pa chitsulo chosanjikiza ndi ceramic ndi yotsika, ndipo kudalirika kwa mankhwalawa kumakhala kotsika mukagwiritsidwa ntchito.
