Tam sim no, kev loj hlob zoo nkauj rau kev tiv thaiv ib puag ncig thiab kev txuag hluav taws xob tau coj lub zog tshiab hluav taws xob hauv tsev mus rau qhov teeb meem. Cov khoom siv hluav taws xob siab siab ua lub luag haujlwm txiav txim siab hauv kev tswj hwm kev ceev ntawm lub tsheb thiab khaws cia hloov AC thiab DC. Kev siv hluav taws xob ntau zaus tau muab cov kev cai nruj rau cov cua kub dissipation ntawm cov khoom siv hluav taws xob, thaum lub sij hawm nyuaj thiab ntau haiv neeg ntawm kev ua hauj lwm ib puag ncig yuav tsum tau ntim cov ntaub ntawv kom muaj thermal shock resistance thiab siab zog los ua lub luag haujlwm txhawb nqa. Tsis tas li ntawd, nrog txoj kev loj hlob sai ntawm cov cuab yeej hluav taws xob niaj hnub siv hluav taws xob, uas yog cov yam ntxwv ntawm high voltage, high tam sim no, thiab high zaus, lub tshav kub dissipation efficiency ntawm lub hwj chim modules siv rau qhov no technology tau dhau los ua qhov tseem ceeb. Cov ntaub ntawv ceramic substrate nyob rau hauv cov tshuab ntim hluav taws xob yog tus yuam sij rau kev ua kom muaj cua sov kom zoo, lawv kuj muaj lub zog siab thiab kev ntseeg siab los teb rau qhov nyuaj ntawm qhov chaw ua haujlwm. Lub ntsiab ceramic substrates uas tau tsim ntau thiab siv dav hauv xyoo tas los no yog Al2O3, BeO, SiC, Si3N4, AlN, thiab lwm yam.
Al2O3 ceramic plays lub luag haujlwm tseem ceeb hauv kev lag luam kub dissipation substrate raws li nws cov txheej txheem kev npaj yooj yim, rwb thaiv tsev zoo thiab kub-resistant. Txawm li cas los xij, qhov qis thermal conductivity ntawm Al2O3 tsis tuaj yeem ua tau raws li kev tsim kho ntawm lub zog siab thiab cov khoom siv hluav taws xob siab, thiab nws tsuas yog siv tau rau qhov chaw ua haujlwm nrog cov kev xav tau ntawm cov cua sov tsawg. Tsis tas li ntawd, lub zog qis qis kuj txwv qhov kev thov ntawm Al2O3 ceramics ua cov cua sov dissipation substrates.
BeO ceramic substrates muaj cov thermal conductivity siab thiab tsis tshua muaj hluav taws xob tsis tu ncua kom ua tau raws li cov kev xav tau ntawm cov cua sov kom zoo. Tab sis nws tsis yog qhov tsim nyog rau daim ntawv thov loj vim tias nws muaj toxicity, uas cuam tshuam rau kev noj qab haus huv ntawm cov neeg ua haujlwm.
AlN ceramic yog suav tias yog cov khoom sib tw rau cov cua kub dissipation substrate vim nws cov thermal conductivity siab. Tab sis AlN ceramic muaj cov thermal shock tsis zoo, yooj yim deliquescence, tsis tshua muaj zog thiab toughness, uas tsis haum rau kev ua hauj lwm nyob rau hauv ib tug complex ib puag ncig, thiab nws yog ib qhov nyuaj los xyuas kom meej qhov kev cia siab ntawm daim ntawv thov.
SiC ceramic muaj cov thermal conductivity siab, vim nws qhov siab dielectric poob thiab tsis tshua muaj hluav taws xob tawg, nws tsis haum rau cov ntawv thov hauv qhov chaw ua haujlwm siab thiab qhov hluav taws xob.
Si3N4 tau lees paub tias yog cov khoom siv ceramic zoo tshaj plaws nrog cov thermal conductivity thiab kev ntseeg siab hauv tsev thiab txawv teb chaws. Txawm hais tias lub thermal conductivity ntawm Si3N4 ceramic substrate yog me ntsis qis dua li ntawm AlN, nws lub zog flexural thiab tawg toughness tuaj yeem ncav cuag ntau tshaj ob npaug ntawm AlN. Lub caij no, cov thermal conductivity ntawm Si3N4 ceramic yog ntau dua li ntawm Al2O3 ceramic. Tsis tas li ntawd, cov coefficient ntawm thermal expansion ntawm Si3N4 ceramic substrates yog ze rau ntawm SiC crystals, lub thib 3 tiam semiconductor substrate, uas ua rau nws sib haum nrog ntau stably nrog SiC siv lead ua khoom. Nws ua Si3N4 cov khoom siv rau cov thermal conductivity substrates rau 3rd tiam SiC semiconductor fais fab khoom.
