Rau kev ntim khoom siv hluav taws xob, ceramic substrates ua lub luag haujlwm tseem ceeb hauv kev sib txuas cov kab hluav taws xob sab hauv thiab sab nraud, nrog rau kev sib txuas hluav taws xob thiab kev txhawb nqa txhua yam. Ceramic substrates muaj qhov zoo ntawm cov thermal conductivity, zoo tshav kub tsis kam, siab mechanical zog, thiab tsawg coefficient ntawm thermal expansion, thiab lawv yog cov khoom siv substrate rau lub hwj chim semiconductor ntaus ntawv ntim.
Hais txog cov qauv thiab cov txheej txheem tsim khoom, ceramic substrates tau muab faib ua 5 hom.
High-Temperature Co-fired Multilayer Ceramic Substrates (HTCC)
Low-Temperature Co-fired Ceramic Substrates (LTCC)
Thick Film Ceramic Substrates (TFC)
Direct Bonded Copper Ceramic Substrates (DBC)
Direct Plated Copper Ceramic Substrates (DPC)
Cov txheej txheem ntau lawm
Direct Bonded Copper (DBC) ceramic substrate yog tsim los ntawm kev ntxiv oxygen ntawm tooj liab thiab ceramic kom tau Cu-O eutectic tov ntawm 1065 ~ 1083 ℃, ua raws li cov tshuaj tiv thaiv kom tau txais theem nrab (CuAlO2 lossis CuAl2O4), yog li paub txog cov tshuaj metallurgical ua ke. ntawm Cu phaj thiab ceramic substrate, thiab tom qab ntawd thaum kawg paub txog kev npaj cov duab los ntawm lithography technology los tsim lub voj voog.
Lub thermal expansion coefficient ntawm DBC substrate yog ze heev rau cov khoom siv ntawm LED epitaxial, uas tuaj yeem txo qhov thermal stress generated ntawm nti thiab substrate.
Direct Plated Copper (DPC) ceramic substrate yog tsim los ntawm sputtering ib txheej tooj liab ntawm cov ceramic substrate, ces exposing, etched, de-filmed, thiab thaum kawg ua rau cov thickness ntawm cov tooj liab kab los ntawm electroplating los yog tshuaj plating, tom qab tshem tawm cov photoresist, lub metalized kab tiav.
Txawv qhov zoo thiab qhov tsis zoo
Qhov zoo ntawm DBC Ceramic Substrate
Txij li cov ntawv ci tooj liab muaj cov hluav taws xob zoo thiab thermal conductivity, DBC muaj qhov zoo ntawm cov thermal conductivity zoo, rwb thaiv tsev zoo, muaj kev ntseeg siab, thiab tau siv dav hauv IGBT, LD, thiab CPV pob. Tshwj xeeb tshaj yog vim cov ntawv ci tooj liab thicker (100 ~ 600μm), nws muaj qhov zoo tshaj plaws hauv kev lag luam ntawm IGBT thiab LD ntim.
Qhov tsis zoo ntawm DBC Ceramic Substrate
Cov txheej txheem tsim khoom siv cov tshuaj tiv thaiv eutectic ntawm Cu thiab Al2O3 ntawm qhov kub thiab txias, uas yuav tsum muaj cov khoom siv ntau lawm thiab kev tswj cov txheej txheem, yog li ua rau tus nqi siab.
Vim qhov yooj yim tiam ntawm microporosity ntawm Al2O3 thiab Cu txheej, uas txo cov thermal poob siab tsis kam ntawm cov khoom, cov kev tsis zoo no ua lub bottleneck ntawm DBC substrate nce qib.
Qhov zoo ntawm DPC Ceramic Substrate
Cov txheej txheem kub qis (qis dua 300 ° C) yog siv, uas zam tag nrho cov kev tsis zoo ntawm qhov kub thiab txias ntawm cov khoom siv lossis kab qauv, thiab tseem txo cov nqi ntawm cov txheej txheem tsim khoom.
Kev siv cov yeeb yaj kiab nyias thiab photolithography thev naus laus zis, kom cov substrate ntawm cov hlau kab zoo dua, yog li DPC substrate yog qhov zoo tagnrho rau kev sib tw ntawm cov kev xav tau siab tshaj plaws rau kev ntim cov khoom siv hluav taws xob.
Qhov tsis zoo ntawm DPC Ceramic Substrate
Limited thickness ntawm electroplated deposited tooj liab txheej thiab siab muaj kuab paug ntawm electroplating pov tseg tov.
Lub zog sib txuas ntawm cov hlau txheej thiab cov ceramic yog tsawg, thiab kev ntseeg siab ntawm cov khoom yog tsawg thaum siv.
