(DBC yumbu substrateSamar daWintrestek)
Kai tsaye Takaddun jan ƙarfe (DBC) substratesWani sabon nau'in kayan kwalliya ne a cikin abin da ƙarfe ƙarfe yana da rufi a kan m insuling alumina (Al2o3) ko nitride na aluminum (AlN) substrate. Fasahar metallization na Alumina da aluminum nitride yankin substrates kusan iri ɗaya ne. Shan saman Al2o3 na al2O3 a matsayin misali, ana auna walwalwar kai tsaye zuwa ga alumancin yanayin tsinkayen tsinkayen tsinkayen tsinkayen tsinkayen tsinkayen tsinkayen tsinkaye.
Hankalin muhalli a cikin yanayin zafi (1065-1085) yana sa ƙarfe na ƙarfe zuwa outectic, wanda ke bayyana jan yaduwar ƙarfe kuma yana haifar da subare na ƙarfe; Sannan shirya layin juzu'i ta hanyar etching gwargwadon layin tsarin bayyanar fallasa fim. Yawancin amfani a cikin marufi na power semiconductor kayayyaki, firiji da kuma high zazzabi.
Allo Circuit na Kwamfutoci da kayan aikin gida mai ƙarancin wuta yawanci suna amfani da ƙarfe da kuma subberic substrates; however, ceramic substrate materials with better thermal properties, such as silicon nitride, aluminum nitride, and alumina, are required for high-voltage, high-current applications, such as power modules, solar inverters, and motor controllers.
DaDBC Substratein power electronic module technology is mainly a variety of chips (IGBT chips, diode chips, resistors, SiC chips, etc.), theDBC SubstrateTa hanyar murfin tagulla, don kammala guntun gyarawa ko haɗa saman haɗin, aikin ya yi kama da na PCB na PCB. DBC substrate yana da kyawawan kaddarorin, kyakkyawan zafi mara kyau, ƙarancin zafi da juriya da inganci.
DaDBC SubstrateYana da waɗannan abubuwan da suka dace da abubuwa masu kyau: rufin mai zafi mara kyau, mai kyau mai zafi mara kyau, ƙarancin haɓakawa mai kyau, kyawawan kayan sarrafawa da aiki mai kyau.
1. Kyakkyawan infulate aikin. Amfani daDBC SubstrateKamar yadda guntu ke tallafawa guntu daga yanayin diski na lalata, DBC substom Layer ko Aln mai yadudduka Layer na ramuka> 2.5kV).
2.5kV).2. Kyakkyawan halayen da yake aiki, daDBC Substrate
Yana da kyakkyawan aiki da wutar lantarki tare da 20-260w / MK, IGBT Module a cikin aikin da ke cikin DBCal, to ta kammala yawan zafin rana na module.
3. Buɗe manyan abubuwan lantarki. Tunda jan ƙarfe ne mai yawan ƙwayoyin cuta, siginar lantarki za'a iya ɗauka tare da karancin juriya game da hanyar kai tsaye tsakanin tagulla da substrate. Saboda wannan, DBC ya dace sosai don amfani a cikin kayan lantarki mai sauri waɗanda ke buƙatar watsa bayanai cikin sauri da dogaro, gami da kwamfutoci da sabobin.4. Faɗakarwar riba taDBC Substrate
Ya yi kama da na Chip.The DBC Substrate na fadada ya yi kama da lalacewar dabicon (7.1ppm / k), wanda ba zai haifar da lalacewar dabicon> 20n / mm2 ba. Bayan haka, kuma yana da kyawawan kayan aikin injiniyoyi da juriya na lalata. DBC ba mai sauƙin yi ba, kuma ana iya amfani dashi akan kewayon zafin jiki mai yawa. 20n / mm2 ba. Bayan haka, kuma yana da kyawawan kayan aikin injiniyoyi da juriya na lalata. DBC ba mai sauƙin yi ba, kuma ana iya amfani dashi akan kewayon zafin jiki mai yawa.5. Welding wasan kwaikwayon yana da kyau. Welding wasan kwaikwayon na
DBC Substrate
